Chin. J. Semicond. > 2002, Volume 23 > Issue 9 > 1001-1005

PDF

Abstract:

The feasibility of improving the light extraction efficiency of GaN/GaAs optical devices by using wafer bonding technique is calculated by the principles of optical thin films. The light extraction efficiency can be improved by 2.65 times when a thin Ni layer is used as an adhesive layer and Ag layer as a reflective layer. Experimental results show that the reflectivity at 459.2 nm of the bonded samples is improved by 2.4 times than the as grown samples.

Key words: cubic GaNwafer bondingdesign process

  • Search

    Advanced Search >>

    Article Metrics

    Article views: 228 Times PDF downloads: 0 Times Cited by: 0 Times

    History

    Received: 28 December 2001 Revised: Online: Published: 01 September 2002

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      SUN Yuan-ping, ZHANG Ze-hong, ZHAO De-gang, FENG Zhi-hong, FU Yi, ZHANG Shu-ming, YANG Hui. Design of High Brightness Cubic-GaN LED Grown on GaAs Substrate[J]. Journal of Semiconductors, 2002, In Press. . Design of High Brightness Cubic-GaN LED Grown on GaAs Substrate[J]. J. Semicond, 2002, In Press. Export: BibTex EndNote
      Citation:
      SUN Yuan-ping, ZHANG Ze-hong, ZHAO De-gang, FENG Zhi-hong, FU Yi, ZHANG Shu-ming, YANG Hui. Design of High Brightness Cubic-GaN LED Grown on GaAs Substrate[J]. Journal of Semiconductors, 2002, In Press.

      . Design of High Brightness Cubic-GaN LED Grown on GaAs Substrate[J]. J. Semicond, 2002, In Press.
      Export: BibTex EndNote

      Design of High Brightness Cubic-GaN LED Grown on GaAs Substrate

      • Received Date: 2001-12-28
        Available Online: 2023-03-15
      • Published Date: 2002-09-01

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return