Abstract: Due to the fact that micro-electromechanical systems (MEMS) based thermal microactuators and displacement amplification mechanisms are all compatible,the stiffness match between these two components is important to consider to achieve adequate output in the design phase.First,the effect of load stiffness on microactuators is theoretically analyzed.The finite element method (FEM) is then used to simulate the performance of both thermal actuators and compatible amplifiers.It is shown that the stiffness ratio between microactuators and compatible transmissions significantly influences the performance of the combined mechanism.Prototypes are fabricated on an SOI substrate with deep reaction ion etching (DRIE) technology and then are tested.Experimental results coincide well with the theoretical predictions.

Key words: micro-electromechanical systems, microactuators, compliant mechanisms, DRIE