Review Articles MORE

• 

  A minireview on technology and application of silicon integrated single crystal perovskite

  Abstract Full Text PDF Metal halide perovskites (MHPs) have become promising optoelectronic materials due to their long carrier lifetimes and high mobility. However, the presence of defects and ion migration in MHPs results in high and unstable dark currents, which compromise the stability and detection performance of MHP-based optoelectronic devices. Interfacial engineering has proven to be an effective strategy to reduce defect density in MHPs and suppress ion migration. Given the compatibility of silicon (Si) and MHP processing technologies, coupled with the simplicity and cost-effectiveness of the approach, the integration of MHPs onto Si surfaces has become a prominent area of research. This integration not only enhances device performance but also expands their practical applications. This review provides an overview of the integration technologies for Si and single crystal MHPs, evaluates the advantages and limitations of various integration schemes (including inverse temperature crystallization, vacuum-assisted vapor deposition, and anti-solvent vapor-assisted crystallization), and explores the practical applications of Si/MHP-integrated optoelectronic devices with different structures. These optimized devices exhibit outstanding performance in X-ray detection, multi-wavelength photodetection, and circularly polarized light detection. This review provides a systematic reference for technological innovation and application expansion of Si/MHP-integrated devices.

  Metal halide perovskites (MHPs) have become promising optoelectronic materials due to their long carrier lifetimes and high mobility. However, the presence of defects and ion migration in MHPs results in high and unstable dark currents, which compromise the stability and detection performance of MHP-based optoelectronic devices. Interfacial engineering has proven to be an effective strategy to reduce defect density in MHPs and suppress ion migration. Given the compatibility of silicon (Si) and MHP processing technologies, coupled with the simplicity and cost-effectiveness of the approach, the integration of MHPs onto Si surfaces has become a prominent area of research. This integration not only enhances device performance but also expands their practical applications. This review provides an overview of the integration technologies for Si and single crystal MHPs, evaluates the advantages and limitations of various integration schemes (including inverse temperature crystallization, vacuum-assisted vapor deposition, and anti-solvent vapor-assisted crystallization), and explores the practical applications of Si/MHP-integrated optoelectronic devices with different structures. These optimized devices exhibit outstanding performance in X-ray detection, multi-wavelength photodetection, and circularly polarized light detection. This review provides a systematic reference for technological innovation and application expansion of Si/MHP-integrated devices.
• 

  High-speed electro-absorption modulated laser

  Abstract Full Text PDF Currently, the global 5G network, cloud computing, and data center industries are experiencing rapid development. The continuous growth of data center traffic has driven the vigorous progress in high-speed optical transceivers for optical interconnection within data centers. The electro-absorption modulated laser (EML), which is widely used in optical fiber communications, data centers, and high-speed data transmission systems, represents a high-performance photoelectric conversion device. Compared to traditional directly modulated lasers (DMLs), EMLs demonstrate lower frequency chirp and higher modulation bandwidth, enabling support for higher data rates and longer transmission distances. This article introduces the composition, working principles, manufacturing processes, and applications of EMLs. It reviews the progress on advanced indium phosphide (InP)-based EML devices from research institutions worldwide, while summarizing and comparing data transmission rates and key technical approaches across various studies.

  Currently, the global 5G network, cloud computing, and data center industries are experiencing rapid development. The continuous growth of data center traffic has driven the vigorous progress in high-speed optical transceivers for optical interconnection within data centers. The electro-absorption modulated laser (EML), which is widely used in optical fiber communications, data centers, and high-speed data transmission systems, represents a high-performance photoelectric conversion device. Compared to traditional directly modulated lasers (DMLs), EMLs demonstrate lower frequency chirp and higher modulation bandwidth, enabling support for higher data rates and longer transmission distances. This article introduces the composition, working principles, manufacturing processes, and applications of EMLs. It reviews the progress on advanced indium phosphide (InP)-based EML devices from research institutions worldwide, while summarizing and comparing data transmission rates and key technical approaches across various studies.
• 

  Robotic computing system and embodied AI evolution: an algorithm-hardware co-design perspective

  Abstract Full Text PDF Robotic computing systems play an important role in enabling intelligent robotic tasks through intelligent algorithms and supporting hardware. In recent years, the evolution of robotic algorithms indicates a roadmap from traditional robotics to hierarchical and end-to-end models. This algorithmic advancement poses a critical challenge in achieving balanced system-wide performance. Therefore, algorithm-hardware co-design has emerged as the primary methodology, which analyzes algorithm behaviors on hardware to identify common computational properties. These properties can motivate algorithm optimization to reduce computational complexity and hardware innovation from architecture to circuit for high performance and high energy efficiency. We then reviewed recent works on robotic and embodied AI algorithms and computing hardware to demonstrate this algorithm-hardware co-design methodology. In the end, we discuss future research opportunities by answering two questions: (1) how to adapt the computing platforms to the rapid evolution of embodied AI algorithms, and (2) how to transform the potential of emerging hardware innovations into end-to-end inference improvements.

  Robotic computing systems play an important role in enabling intelligent robotic tasks through intelligent algorithms and supporting hardware. In recent years, the evolution of robotic algorithms indicates a roadmap from traditional robotics to hierarchical and end-to-end models. This algorithmic advancement poses a critical challenge in achieving balanced system-wide performance. Therefore, algorithm-hardware co-design has emerged as the primary methodology, which analyzes algorithm behaviors on hardware to identify common computational properties. These properties can motivate algorithm optimization to reduce computational complexity and hardware innovation from architecture to circuit for high performance and high energy efficiency. We then reviewed recent works on robotic and embodied AI algorithms and computing hardware to demonstrate this algorithm-hardware co-design methodology. In the end, we discuss future research opportunities by answering two questions: (1) how to adapt the computing platforms to the rapid evolution of embodied AI algorithms, and (2) how to transform the potential of emerging hardware innovations into end-to-end inference improvements.
• 

  Nucleation control for the growth of two-dimensional single crystals

  Abstract Full Text PDF The unique structure and exceptional properties of two-dimensional (2D) materials offer significant potential for transformative advancements in semiconductor industry. Similar to the reliance on wafer-scale single-crystal ingots for silicon-based chips, practical applications of 2D materials at the chip level needs large-scale, high-quality production of 2D single crystals. Over the past two decades, the size of 2D single-crystals has been improved to wafer or meter scale, where the nucleation control during the growth process is particularly important. Therefore, it is essential to conduct a comprehensive review of nucleation control in 2D materials to gain fundamental insights into the growth of 2D single-crystal materials. This review mainly focuses on two aspects: controlling nucleation density to enable the growth from a single nucleus, and controlling nucleation position to achieve the unidirectionally aligned islands and subsequent seamless stitching. Finally, we provide an overview and forecast of the strategic pathways for emerging 2D materials.

  The unique structure and exceptional properties of two-dimensional (2D) materials offer significant potential for transformative advancements in semiconductor industry. Similar to the reliance on wafer-scale single-crystal ingots for silicon-based chips, practical applications of 2D materials at the chip level needs large-scale, high-quality production of 2D single crystals. Over the past two decades, the size of 2D single-crystals has been improved to wafer or meter scale, where the nucleation control during the growth process is particularly important. Therefore, it is essential to conduct a comprehensive review of nucleation control in 2D materials to gain fundamental insights into the growth of 2D single-crystal materials. This review mainly focuses on two aspects: controlling nucleation density to enable the growth from a single nucleus, and controlling nucleation position to achieve the unidirectionally aligned islands and subsequent seamless stitching. Finally, we provide an overview and forecast of the strategic pathways for emerging 2D materials.