SEMICONDUCTOR INTEGRATED CIRCUITS

Optimal design analysis for thermal performance of high power 2.5D package

Xiaoyang Liu, He Ma, Daquan Yu, Wenlu Chen and Xiaolong Wu

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 Corresponding author: Liu Xiaoyang, Email:liuxy1978@163.com

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Abstract: Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determination of the contributing factors and their effects on the thermal resistance and heat distribution of the package. The parametric analysis illustrates that the substrate conductivity, TIM conductivity and fin height are more crucial for heat conduction in the package. Furthermore, these major parameters are compared and analyzed by orthogonal tests, and the optimal solution for 2.5D integration is proposed. The factors' influence patterns on thermal resistance, obtained in this article, could be utilized as a thermal design reference.

Key words: 2.5D packagehigh powerthermal designANSYS



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Fig1.  The structure of the 2.5D packaging.

Fig2.  Compact thermal resistance model.

Fig3.  TSV interposer versus $\Gamma _{\rm jB}$.

Fig4.  Substrate versus $\Gamma_{\rm jB}$.

Fig5.  TIM1 versus $\Gamma_{\rm jC}$.

Fig6.  Cu lid versus $\Gamma_{\rm jC}$.

Fig7.  Heatsink height (Base_Height {\&} Fin Height) versus $\Gamma_{\rm Ca}$.

Fig8.  Temperature contour for the final optimal package model.

Table 1.   Typical sizes of the model.

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Table 2.   Material properties for the simulation model.

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表3.   Orthogonal tests and results.

Table 3

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    Received: 03 July 2015 Revised: Online: Published: 01 March 2016

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      Xiaoyang Liu, He Ma, Daquan Yu, Wenlu Chen, Xiaolong Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. Journal of Semiconductors, 2016, 37(3): 035006. doi: 10.1088/1674-4926/37/3/035006 X Y Liu, H Ma, D Q Yu, W L Chen, X L Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. J. Semicond., 2016, 37(3): 035006. doi: 10.1088/1674-4926/37/3/035006.Export: BibTex EndNote
      Citation:
      Xiaoyang Liu, He Ma, Daquan Yu, Wenlu Chen, Xiaolong Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. Journal of Semiconductors, 2016, 37(3): 035006. doi: 10.1088/1674-4926/37/3/035006

      X Y Liu, H Ma, D Q Yu, W L Chen, X L Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. J. Semicond., 2016, 37(3): 035006. doi: 10.1088/1674-4926/37/3/035006.
      Export: BibTex EndNote

      Optimal design analysis for thermal performance of high power 2.5D package

      doi: 10.1088/1674-4926/37/3/035006
      Funds:

      Project supported by the National S & T Major Projects(No.2011ZX02709-2) and the China National Science Foundation(No.61176098).

      More Information
      • Corresponding author: Liu Xiaoyang, Email:liuxy1978@163.com
      • Received Date: 2015-07-03
      • Accepted Date: 2015-09-06
      • Published Date: 2016-01-25

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