J. Semicond. > 2016, Volume 37 > Issue 3 > 035006, doi: 10.1088/1674-4926/37/3/035006

SEMICONDUCTOR INTEGRATED CIRCUITS

# Optimal design analysis for thermal performance of high power 2.5D package

Corresponding author: Liu Xiaoyang, Email:liuxy1978@163.com

Abstract: Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determination of the contributing factors and their effects on the thermal resistance and heat distribution of the package. The parametric analysis illustrates that the substrate conductivity, TIM conductivity and fin height are more crucial for heat conduction in the package. Furthermore, these major parameters are compared and analyzed by orthogonal tests, and the optimal solution for 2.5D integration is proposed. The factors' influence patterns on thermal resistance, obtained in this article, could be utilized as a thermal design reference.

Key words: ANSYS

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Fig1.  The structure of the 2.5D packaging.

Fig2.  Compact thermal resistance model.

Fig3.  TSV interposer versus $\Gamma _{\rm jB}$.

Fig4.  Substrate versus $\Gamma_{\rm jB}$.

Fig5.  TIM1 versus $\Gamma_{\rm jC}$.

Fig6.  Cu lid versus $\Gamma_{\rm jC}$.

Fig7.  Heatsink height (Base_Height {\&} Fin Height) versus $\Gamma_{\rm Ca}$.

Fig8.  Temperature contour for the final optimal package model.

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Received: 03 July 2015 Revised: Online: Published: 01 March 2016

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Xiaoyang Liu, He Ma, Daquan Yu, Wenlu Chen, Xiaolong Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. Journal of Semiconductors, 2016, 37(3): 035006. doi: 10.1088/1674-4926/37/3/035006 X Y Liu, H Ma, D Q Yu, W L Chen, X L Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. J. Semicond., 2016, 37(3): 035006. doi: 10.1088/1674-4926/37/3/035006.Export: BibTex EndNote
 Citation: Xiaoyang Liu, He Ma, Daquan Yu, Wenlu Chen, Xiaolong Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. Journal of Semiconductors, 2016, 37(3): 035006. X Y Liu, H Ma, D Q Yu, W L Chen, X L Wu. Optimal design analysis for thermal performance of high power 2.5D package[J]. J. Semicond., 2016, 37(3): 035006. doi: 10.1088/1674-4926/37/3/035006. Export: BibTex EndNote

# Optimal design analysis for thermal performance of high power 2.5D package

##### doi: 10.1088/1674-4926/37/3/035006
Funds:

Project supported by the National S & T Major Projects(No.2011ZX02709-2) and the China National Science Foundation(No.61176098).

• Corresponding author: Liu Xiaoyang, Email:liuxy1978@163.com