SEMICONDUCTOR DEVICES

Design space of electrostatic chuck in etching chamber

Yuchun Sun, Jia Cheng, Yijia Lu, Yuemin Hou and Linhong Ji

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 Corresponding author: Ji Linhong, jilh@tsinghua.edu.cn

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Abstract: One of the core semiconductor devices is the electrostatic chuck. It has been widely used in plasma-based and vacuum-based semiconductor processing. The electrostatic chuck plays an important role in adsorbing and cooling/heating wafers, and has technical advantages on non-edge exclusion, high reliability, wafer planarity, particles reduction and so on. This article extracts key design elements from the existing knowledge and techniques of electrostatic chuck by the method proposed by Paul and Beitz, and establishes a design space systematically. The design space is composed of working objects, working principles and working structures. The working objects involve electrostatic chuck components and materials, classifications, and relevant properties; the working principles involve clamping force, residual force, and temperature control; the working structures describe how to compose an electrostatic chuck and to fulfill the overall functions. The systematic design space exhibits the main issues during electrostatic chuck design. The design space will facilitate and inspire designers to improve the design quality and shorten the design time in the conceptual design.

Key words: design spaceelectrostatic chuckclamping forcetemperature control



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Fig1.  The constitution of ESC current design space.

Fig2.  Schematic graph of ESC components.

Fig3.  Schematic graph of E-chuck adsorbing principle. (a) Coulomb type. (b) J-R type[26].

.  Heat budget model of ESC.

Fig.4


Fig5.  Four types of ESC with different structures.

Fig6.  Timing settings of working signals of the monopolar type ESC.

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    Received: 29 January 2015 Revised: Online: Published: 01 August 2015

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      Yuchun Sun, Jia Cheng, Yijia Lu, Yuemin Hou, Linhong Ji. Design space of electrostatic chuck in etching chamber[J]. Journal of Semiconductors, 2015, 36(8): 084004. doi: 10.1088/1674-4926/36/8/084004 Y C Sun, J Cheng, Y J Lu, Y M Hou, L H Ji. Design space of electrostatic chuck in etching chamber[J]. J. Semicond., 2015, 36(8): 084004. doi: 10.1088/1674-4926/36/8/084004.Export: BibTex EndNote
      Citation:
      Yuchun Sun, Jia Cheng, Yijia Lu, Yuemin Hou, Linhong Ji. Design space of electrostatic chuck in etching chamber[J]. Journal of Semiconductors, 2015, 36(8): 084004. doi: 10.1088/1674-4926/36/8/084004

      Y C Sun, J Cheng, Y J Lu, Y M Hou, L H Ji. Design space of electrostatic chuck in etching chamber[J]. J. Semicond., 2015, 36(8): 084004. doi: 10.1088/1674-4926/36/8/084004.
      Export: BibTex EndNote

      Design space of electrostatic chuck in etching chamber

      doi: 10.1088/1674-4926/36/8/084004
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      Project supported by the Ministry of Science and Technology of China (No. 2011ZX02403), and the National Natural Science Foundation of China (No. 51175284).

      More Information
      • Corresponding author: Ji Linhong, jilh@tsinghua.edu.cn
      • Received Date: 2015-01-29
      • Accepted Date: 2015-04-02
      • Published Date: 2015-01-25

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