J. Semicond. > 2009, Volume 30 > Issue 10 > 104006

SEMICONDUCTOR DEVICES

Thermal time constant of a terminating type MEMS microwave power sensor

Xu Yinglin and Liao Xiaoping

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DOI: 10.1088/1674-4926/30/10/104006

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Abstract: A terminating type MEMS microwave power sensor based on the Seebeck effect and compatible with the GaAs MMIC process is presented. An electrothermal model is introduced to simulate the thermal time constant. An analytical result, about 160 ms, of the thermal time constant from the non-stationary Fourier heat equations for the structure of the sensor is also given. The sensor measures the microwave power jumping from 15 to 20 dBm at a constant frequency 15 GHz, and the experimental thermal time constant result is 180 ms. The frequency is also changed from 20 to 10 GHz with a constant power 20 dBm, and the result is also 180 ms. Compared with the analytical and experimental results, the model is verified.

Key words: MEMS thermal time constant microwave power electrothermal model

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    Received: 18 August 2015 Revised: 12 May 2009 Online: Published: 01 October 2009

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      Xu Yinglin, Liao Xiaoping. Thermal time constant of a terminating type MEMS microwave power sensor[J]. Journal of Semiconductors, 2009, 30(10): 104006. doi: 10.1088/1674-4926/30/10/104006 ****Xu Y L, Liao X P. Thermal time constant of a terminating type MEMS microwave power sensor[J]. J. Semicond., 2009, 30(10): 104006. doi: 10.1088/1674-4926/30/10/104006.
      Citation:
      Xu Yinglin, Liao Xiaoping. Thermal time constant of a terminating type MEMS microwave power sensor[J]. Journal of Semiconductors, 2009, 30(10): 104006. doi: 10.1088/1674-4926/30/10/104006 ****
      Xu Y L, Liao X P. Thermal time constant of a terminating type MEMS microwave power sensor[J]. J. Semicond., 2009, 30(10): 104006. doi: 10.1088/1674-4926/30/10/104006.

      Thermal time constant of a terminating type MEMS microwave power sensor

      DOI: 10.1088/1674-4926/30/10/104006
      • Received Date: 2015-08-18
      • Accepted Date: 2009-03-16
      • Revised Date: 2009-05-12
      • Published Date: 2009-09-28

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