Qingqing Wang, Yun Zheng, Chonghao Zhai, Xudong Li, Qihuang Gong, Jianwei Wang. Chip-based quantum communications[J]. Journal of Semiconductors, 2021, 42(9): 091901. doi: 10.1088/1674-4926/42/9/091901.
Q Q Wang, Y Zheng, C H Zhai, X D Li, Q H Gong, J W Wang, Chip-based quantum communications[J]. J. Semicond., 2021, 42(9): 091901. doi: 10.1088/1674-4926/42/9/091901.
Export: BibTex EndNote
Field-limiting-ring (FLR) terminations require the simultaneous optimization of multiple structural parameters, while conventional TCAD-based design is computationally expensive and often involves a trade-off between breakdown voltage (BV) and termination footprint. In this work, an area-oriented multi-objective optimization framework is developed for the FLR termination of a 650 V Si IGBT, in which BV is maximized while the total termination length (Lt) used as a geometric metric of termination-area consumption, is minimized. A deep neural network (DNN) surrogate model is trained using 420 Sentaurus TCAD samples to predict BV from the FLR structural parameters and is subsequently integrated with multi-objective particle swarm optimization (MOPSO) to construct the BV−Lt Pareto front. The DNN achieves R2 = 0.9988, a MAE of 1.5 V, and a RMSE of 1.9 V on the held-out TCAD test set. Three representative Pareto solutions are further verified by full TCAD simulations. Under nearly identical termination-length conditions, Pareto Solution 1 increases the TCAD-verified BV from 950 to 990 V, whereas under comparable BV conditions, Pareto Solution 3 reduces Lt from 290.0 to 201.9 μm, corresponding to a 30.4% reduction, while maintaining a slightly higher BV. In addition, a fabricated device based on Pareto Solution 2 exhibits close agreement between the measured and TCAD-simulated reverse I−V characteristics. These results demonstrate the effectiveness of the proposed TCAD−DNN−MOPSO framework for BV−termination-footprint co-optimization and indicate its potential extensibility to other power-device design problems.