J. Semicond. > 2009, Volume 30 > Issue 9 > 094001

SEMICONDUCTOR DEVICES

Influence of body contact of SOI MOSFETs on the thermal conductance of devices

Lu Shuojin, Liu Mengxin and Han Zhengsheng

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DOI: 10.1088/1674-4926/30/9/094001

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Abstract: The thermal conductance of devices with different body contacts is studied. A new analytical expression is proposed. This expression can be used in parameter extraction, which gives both good efficiency and high precision. The ratio of thermal conductance of the body contact region to that of the body region is nearly equal to the ratio of the area. The use of an H shape gate body contact is suggested to aid power dissipation in SOI MOSFETs.

Key words: thermal conductance body contact parameter extraction power dissipation

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    Received: 18 August 2015 Revised: 25 April 2009 Online: Published: 01 September 2009

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      Lu Shuojin, Liu Mengxin, Han Zhengsheng. Influence of body contact of SOI MOSFETs on the thermal conductance of devices[J]. Journal of Semiconductors, 2009, 30(9): 094001. doi: 10.1088/1674-4926/30/9/094001 ****Lu S J, Liu M X, Han Z S. Influence of body contact of SOI MOSFETs on the thermal conductance of devices[J]. J. Semicond., 2009, 30(9): 094001. doi: 10.1088/1674-4926/30/9/094001.
      Citation:
      Lu Shuojin, Liu Mengxin, Han Zhengsheng. Influence of body contact of SOI MOSFETs on the thermal conductance of devices[J]. Journal of Semiconductors, 2009, 30(9): 094001. doi: 10.1088/1674-4926/30/9/094001 ****
      Lu S J, Liu M X, Han Z S. Influence of body contact of SOI MOSFETs on the thermal conductance of devices[J]. J. Semicond., 2009, 30(9): 094001. doi: 10.1088/1674-4926/30/9/094001.

      Influence of body contact of SOI MOSFETs on the thermal conductance of devices

      DOI: 10.1088/1674-4926/30/9/094001
      • Received Date: 2015-08-18
      • Accepted Date: 2009-02-18
      • Revised Date: 2009-04-25
      • Published Date: 2009-08-28

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