Citation: |
Hongqi Jing, Li Zhong, Yuxi Ni, Junjie Zhang, Suping Liu, Xiaoyu Ma. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. Journal of Semiconductors, 2015, 36(10): 102006. doi: 10.1088/1674-4926/36/10/102006
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H Q Jing, L Zhong, Y X Ni, J J Zhang, S P Liu, X Y Ma. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. J. Semicond., 2015, 36(10): 102006. doi: 10.1088/1674-4926/36/10/102006.
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Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics
DOI: 10.1088/1674-4926/36/10/102006
More Information
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Abstract
A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks.Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software.Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced.Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime.This heat-sink is an ideal choice for the package of high power density laser diode array stacks.-
Keywords:
- heat-sink,
- thermal simulation,
- flow velocity,
- temperature
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References
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