J. Semicond. > 2015, Volume 36 > Issue 6 > 064011
|

SEMICONDUCTOR DEVICES

Thermal simulation of flexible LED package enhanced with copper pillars

Yang Liu1, 2, 4, , Guoqi Zhang3, 5 and Fenglian Sun1

+ Author Affiliations

 Corresponding author: Yang Liu, Email: lyang805@163.com

DOI: 10.1088/1674-4926/36/6/064011

PDF

Abstract: Chip on flexible substrate (COF) is a new packaging technology for light emitting diodes (LED). This paper investigated the effect of Cu-pillar in the polyimide (PI) layer on the thermal properties of COF LED packages by finite element analysis. The thermal distribution and thermal resistance were studied in both COF LED packages with and without Cu-pillar. The PI layer showed the highest thermal resistance in the typical package and led to a high chip temperature. With the addition of Cu-pillars, however, the thermal resistance of the PI layer significantly decreased due to the improvement of vertical thermal dissipation under LED chips. Based on the results of simulation and calculation, the relationship between the amount of Cu-pillar and thermal resistance of the COF package has been built. For the packages studied in this research, an 8 × 8 Cu-pillars array was adequate to improve the thermal performance of COF packages.

Key words: COF, LED, Cu-pillar, thermal performance, FE simulation



[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
Fig. 1.  Schematic diagram and thermal path of COF with metal pillars introduced under the LED chip.

DownLoad: Full-Size Img PowerPoint
Fig. 2.  Thermal distribution of the packages. (a) Top surface of no Cu-pillar package. (b) Top surface of package with 8 $\times$ 8 Cu-pillars. (c) Top surface of package with 16 $\times$ 16 Cu-pillars. (d) Bottom surface of no Cu-pillar package. (e) Bottom surface of package with 8 $\times$ 8 Cu-pillars. (f) Bottom surface of package with 8 $\times$ 8 Cu-pillars.

DownLoad: Full-Size Img PowerPoint
Fig. 3.  Cross-sectional thermal distribution of the packages with (a) no Cu-pillar,(b) 8 $\times$ 8 Cu-pillars,and (c) 16 $\times$ 16 Cu-pillars.

DownLoad: Full-Size Img PowerPoint
Fig. 4.  Thermal resistance of each layer in the packages.

DownLoad: Full-Size Img PowerPoint
Fig. 5.  Relationships between heat power and chip temperature.

DownLoad: Full-Size Img PowerPoint
Fig. 6.  Relationship between $1/R_{\rm parallel}$ and area ratio of Cu-pillar.

DownLoad: Full-Size Img PowerPoint
DownLoad: CSV
DownLoad: CSV
DownLoad: CSV

Table 1.   Geometric details and thermal conductivity of layers.

DownLoad: CSV
DownLoad: CSV
DownLoad: CSV

Table 2.   Surface temperature and thermal resistance of the packages.

DownLoad: CSV
DownLoad: CSV
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]

    • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 3167 Times PDF downloads: 40 Times Cited by: 0 Times

    History

    Received: 17 October 2014 Revised: Online: Published: 01 June 2015

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 2015  >  36(6): 064011
      Yang Liu, Guoqi Zhang, Fenglian Sun. Thermal simulation of flexible LED package enhanced with copper pillars[J]. Journal of Semiconductors, 2015, 36(6): 064011. doi: 10.1088/1674-4926/36/6/064011 ****Y Liu, G Q Zhang, F L Sun. Thermal simulation of flexible LED package enhanced with copper pillars[J]. J. Semicond., 2015, 36(6): 064011. doi: 10.1088/1674-4926/36/6/064011.
      Citation:
      Yang Liu, Guoqi Zhang, Fenglian Sun. Thermal simulation of flexible LED package enhanced with copper pillars[J]. Journal of Semiconductors, 2015, 36(6): 064011. doi: 10.1088/1674-4926/36/6/064011 ****
      Y Liu, G Q Zhang, F L Sun. Thermal simulation of flexible LED package enhanced with copper pillars[J]. J. Semicond., 2015, 36(6): 064011. doi: 10.1088/1674-4926/36/6/064011.
      shu

      Thermal simulation of flexible LED package enhanced with copper pillars

      DOI: 10.1088/1674-4926/36/6/064011
      • 1.

        School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China

      • 2.

        Beijing Research Centre, Delft University of Technology, Beijing 100083, China

      • 3.

        Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

      • 4.

        State Key Laboratory of Solid State Lighting, Changzhou 213161, China

      • 5.

        DIMES Center for SSL Technologies, Delft University of Technology, Delft 2628CT, Netherlands

      Funds:

      Project supported by the Research and Scientific Foundation of Heilongjiang Education Department (No. 12541112).

      More Information
      • Corresponding author: Email: lyang805@163.com
      • Received Date: 2014-10-17
      • Accepted Date: 2014-11-09
      • Published Date: 2015-01-25

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return