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J. Semicond. > 2017, Volume 38 > Issue 5 > 055001

SEMICONDUCTOR INTEGRATED CIRCUITS

Poly-Si TFTs integrated gate driver circuit with charge-sharing structure

Meng Chen, Jiefeng Lei, Shengxiang Huang, Congwei Liao and Lianwen Deng

+ Author Affiliations

 Corresponding author: Liao Congwei, Email: 289114489@qq.com

DOI: 10.1088/1674-4926/38/5/055001

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Abstract: A p-type low-temperature poly-Si thin film transistors (LTPS TFTs) integrated gate driver using 2 non-overlapped clocks is proposed. This gate driver features charge-sharing structure to turn off buffer TFT and suppresses voltage feed-through effects. It is analyzed that the conventional gate driver suffers from waveform distortions due to voltage uncertainty of internal nodes for the initial period. The proposed charge-sharing structure also helps to suppress the unexpected pulses during the initialization phases. The proposed gate driver shows a simple circuit, as only 6 TFTs and 1 capacitor are used for single-stage, and the buffer TFT is used for both pulling-down and pulling-up of output electrode. Feasibility of the proposed gate driver is proven through detailed analyses. Investigations show that voltage bootrapping can be maintained once the bootrapping capacitance is larger than 0.8 pF, and pulse of gate driver outputs can be reduced to 5 μs. The proposed gate driver can still function properly with positive VTH shift within 0.4 V and negative VTH shift within-1.2 V and it is robust and promising for high-resolution display.

Key words: LTPS TFTcharge-sharingintegrated gate driver

The low temperature poly-Si thin film transistor (LTPS TFT) is an excellent candidate for realizing high performance active matrix liquid crystalline display (AMLCD) or organic light emitting diode display (AMOLED) [1, 2]. Compared with hydrogenated amorphous silicon (a-Si:H) TFT or metal-oxide (MO) TFTs, LTPS TFT possesses many merits, such as high mobility and good stability over long operating time with voltage or current stressing[3, 4]. In particular, p-type LTPS TFTs are widely used as the stability of p-type transistor is better than that of n-type transistor[5]. In addition, gate driver and de-mux circuits can also be implemented using LTPS TFTs for simplification of the manufacturing process[6, 7]. Integration of the gate driver is critical for narrow bezel display panel, as the number of external ICs and its related connections can be reduced, and also module process can be greatly simplified[8, 9].

However, an integrated gate driver cannot be implemented using conventional CMOS circuit topology with only p-type LTPS TFTs. Several new gate driver schematics employing bootstrapping methods were proposed previously[10-17]. Ha et al. proposed an integrated gate driver using multiple clock signals (CKs)[10]. Although structure of the circuit seems quite simple as only 6 TFTs are required for every single stage, clock bus lines occupy too much of the layout areas. What is more, numbers of external level-shifter ICs will be increased. Han et al. proposed that a gate driver can also be implemented using only two clock signals and a doublebootstrapping scheme was illustrated[12]. But the number of TFTs of single stage is increased which hinders the narrowing of display bezel.

This paper presents a new simple p-type LTPS TFTs integrated gate driver circuit with two non-overlapped clocks. For the single gate driver stage, only six TFTs and one capacitor are used. The influence of TFTs' size and capacitance on transient performance of the proposed gate driver is thoroughly investigated.

Fig. 1 shows a schematic of a conventional gate driver with single stage[18], which consists of 10 TFTs and 1 capacitor. Fig. 1(b) illustrates the simulated waveforms. It is observed that, although low level pulses of OUT[n] can be generated following that of IN, unexpected pulses appear at the initialization period of frame time. For the initialization period, many TFTs are cut off, such an T1, T2 and other TFTs which are signed with 'X'. Thus, T5 and T6 are both in the high impedance state as the gate electrode of T5 (i.e. node Q) and T6 (i.e. node P) is uncertain. Therefore, OUT[n] is determined by equivalent resistant of T5 and T6 and it cannot be maintained at VH. Unfortunately, the distortion in OUT[n] is prone to lead to false operation of the following gate driver stages.

Figure  1.  (Color online) The conventional gate driver with schematic of (a) single stage and (b) timing diagram.

Fig. 2 shows a schematic of the proposed gate driver with block diagram, and single-stage circuit, and the timing diagram. Single stage of the proposed gate driver consists of input part, driving part, discharging part, and high-level-holding part. The input part includes T3, which connects the input terminal and gate electrode of T1 (i.e. node Q). The driving part includes T1 and C1, which pulls-up/down output terminal by the bootstrapping method, while the discharging part includes T2 and voltage of node Q is pulled down by charge sharing between node Q and output terminal. The high-level-holding part includes T4, T5 and T6. In addition, IN is the input signal, and VH/VL represent the high/low voltage level of the CKs/IN. OUT is the output terminal, which is connected with gate lines of TFT panel. For simplicity of analysis, gate lines of TFT panel can be modeled by serially connecting RL and CL.

Figure  2.  The proposed integrated gate driver with (a) block diagram, (b) schematic for single stage gate driver, and (c) timing diagram.

The timing diagram is shown in Fig. 2 (c), and circuit operations are detailed as follows.

In the P1 phase, T3 is turned off as the voltage level of IN is VH. When CK1 switches to VL, T2 and T4 are turned on. Thus T5 is also turned on as node P is pulled down to VL. Consequently, node Q and OUT[n] are connected through T2 and they are both charged up to GND through T5. Otherwise, if CK1 is at the level of VH, node Q and OUT[n] maintain the level of GND. For the initialization period, whether CK1 is VH or VL, T1 can be well turned off, and the level of node Q and OUT[n] are maintaining the level of GND. In other words, the unexpected pulses during the initialization phase can be avoided for the proposed schematic.

In the P2 phase, T2 and T4 are turned off as their gate electrodes are biased with VH. T3 is turned on as the level of IN is VL. Thus node Q is pulled down to VL-VTH3 where VTH3 denotes the threshold voltage of T3. Hence, T1 and T6 are turned on. As a result, T5 is turned off as node P is pulled up to VH through T6. For P2 phase, OUT[n] maintains the level of VH as OUT[n] is connected with CK1 through T1.

In the following P3 phase, T1 and T6 are still kept on as voltage of their gate electrodes (node Q) remains low. As CK1 switches to VL, OUT[n] can be pulled down to VL through T1. The charges accumulated during the pre-charge period are re-distributed between the capacitance associated with node Q, namely T1's gate-to-source capacitance (CGS1), gate-to-drain capacitance (CGD1), and C1. As Q node is nearly floating, according to the charge conservation law, voltage of Q node is bootstrapped to (VL-VTH3)+(VL-VH). It seems that T2 is turned on during P3 period as its gate electrode is biased with VL. However, due to the bootstrapping effect, the voltage of T2's source (i.e. OUT[n]) is pulled-down to VL in a short time, and the voltage of T2's drain (i.e. Q) is decreased to (VL-VTH3)+(VL-VH), so T2 can be turned off as VGS2 equals 0, which is larger than VTH2. Although there might be leakage current through T2 during the transient time, as falling time of OUT[n] is relatively short, it is reasonable to assume that Q node is floating. In addition, because both T4 and T6 are turned on, voltage of node P depends on the voltage distribution between T4 and T6. Since T4 operates in the saturation region, the conduction current of T4 can be expressed as

IT4=12μnCOXWT4L(VLVPVTH4)2,

(1)

where μn, COX are the mobility and gate capacitance per unit area, respectively, and WT4 and L are width and length of T4, respectively.

For T6, as it operates in the linear region, the conduction current of T6 can be expressed as

IT6=μnCOXWT6L[(VQVTH6)(VP)12VP2],

(2)

where WT6 represents width of T6. As T4 and T6 are serially connected, their currents are equaled, and it can be derived that

12μnCOXWT4L(VLVPVTH4)2=μnCOXWT6L[(VQVTH6)(VP)12VP2].

(3)

As both T4 and T6 are switching transistors, their width is usually chosen the same. Thus, it is convenient to derive that

VP=16(VLVTH4).

(4)

As the voltage of T5's source (i.e. OUT[n]) is pulled-down to VL, T5 is turned off as VGS5 equals VP =16(VL-VTH4), which is larger than VTH5.

When CK1 switches to VH, T2, T3 and T4 are turned off. Thus Q node is still floating. Although voltage of Q node is positively coupled to VL-VTH3 due to feed through effect, T1 is still turned on. Thus OUT[n] can be pulled up to VH through T1. In addition, Node P is charged up to GND through T6. So T5 has no contribution to pulling-up of OUT[n], and T1 takes the role of both pulling-down and pulling-up of OUT[n] to save layout areas.

In the P4 phase, when CK1 switches to VL, T2 is turned on. Consequently, Q node and OUT[n] are connected together through T2, and voltage of Q node depends on the charge-sharing effect between capacitance of gate line (CL) and Q node (C1). The charge stored on the capacitor C1 during the pre-charge and bootstrapping period is approximately

Q1=C1(VLVTH3).

(5)

After pulling-up period, voltage of CL is ground, thus charge stored on CL is

Q2=0.

(6)

Thus, due to charge-sharing effect, voltage of node Q can be expressed as

VQ=C1(VLVTH3)C1+CL.

(7)

As CL is much greater than C1, by the end of charge-sharing period, VQ can be pulled up to ground level approximately. Consequently, T1 can be turned off in a relatively short time. In addition, voltage of node P can be pulled down to VL-VTH4 as T4 is turned on. Thus T5 is turned on and OUT[n] can be maintained at ground level through T5.

In the P5 phase, when CK1 switches to VL, T2, T4 and T5 are turned on. Thus node Q and OUT[n] are still connected through T2. Consequently, both node Q and OUT[n] can be maintained at VH and T1 is turned off. On the other hand, when CK1 switches to VH, although T2 and T4 are turned off, T5 can still be kept on as voltage of node P maintains the low level by gate capacitance of T5. Thus voltage of OUT[n] is connected with GND through T5. The voltage of Q can also be kept by GND due to capacitances associated with node Q. To sum up, whether CK1 is VH or VL, both node Q and OUT[n] are kept at VH for P5 period, and clock feed-through effects can be avoided[19].

Simulations using SmartSpice are carried out for the verification of the proposed gate circuit. RPI model with level 36 is used for LTPS TFT characteristic modeling and parameters are adjusted correspondingly. Fig. 3 shows the comparison of simulated current-voltage (I-V) and that of the experimental results. The dots and lines represent the measured and simulated results, respectively. The simulated results are a good match with the measured ones.

Figure  3.  (Color online) The IV curve of LTPS TFT with the RPI model and measurement.

Table 1 shows the extracted parameters for LTPS TFTs. The threshold voltage and mobility are extracted using the linear-interception method. Here, gate capacitance per unit area (COX) is estimated to be 34.5 nF/cm2.

Table  1.  Device parameters of LTPS TFT.
DownLoad: CSV  | Show Table

Table 2 shows the device parameters of the proposed gate driver. The clock pluses have an amplitude of 15 V, with high level VH = 0 V and low level VL =-15 V. The bootstrap capacitance C1 and the load capacitance CL are 0.8 and 300~pF, respectively. In addition, the load resistance is 2000 Ω.

Table  2.  Device parameters of the integrated gate driver.
DownLoad: CSV  | Show Table

Fig. 4 shows the simulation results of the proposed circuit. The falling and rising time of OUT[1] is 1.69 and 2.28 μs, respectively. Voltage of node P can be kept low, and noise voltage during the initialization phase can be suppressed. The aforementioned operating mechanism of the gate driver is well verified by the simulation results. It is also observed that there is waveform burr of node Q by the rising and falling edge of CK1 due to feedthrough effects associated with the CGS1. As previously mentioned, the coupled charges at node Q can be discharged through T2 and T5, thus these waveform burrs last a rather short time. Therefore node Q can still be maintained at VH.

Figure  4.  (Color online) The transient response of the proposed gate driver unit.

Fig. 5 shows the waveforms of OUT[1], OUT[3], OUT[98] and OUT[100] for the proposed circuit. The pulse width of the CKs is reduced to 5 μs. The proposed gate driver can still correctly generate the sequential scanning signals for gate lines, which might be used in high resolution display applications.

Figure  5.  (Color online) The transient response of OUT[n] with pulse width of 5 μs.

Fig. 6 shows the waveforms of the proposed gate driver with different C1. In the case of C1 equaling 0.2 and 0.5 pF, scanning pulse in OUT[n] disappears and the gate driver malfunctions. Bootstrapping operations can only be guaranteed if C1 is increased to be larger than 0.8 pF. This is in close relationship with the turning-on interval for T2 during the bootstrapping phase. As mentioned before, there is positive feedback with the falling of OUT[n] and turning-off of T2. If C1 is too small, the charges stored at node Q can easily be leaked through T2 and T1 will be turned off instead of being active for pulling-down/up of OUT[n]. It seems that C1 should be as large as possible for enhancing the bootstrapping effects. However, layout areas will be increased unexpectedly with too much C1. Consequently, trade-offs should be made between the transient performance and layout areas for the choice of C1.

Figure  6.  (Color online) Simulated waveforms of Q, P and OUT[n] with the increase of C1.

Fig. 7(a) shows the evolution of falling/rising time of OUT[n] versus different VTH. It is observed that, the falling/rising times are increased with the increase of VTH. This seems controversial as increasing of threshold voltage should result in increasing of T1's conductivity, which should help decreasing of rising and falling time. The explanations are provided as follows. The equivalent resistance of T1 can be approximately expressed as

Req=1μnCOXWT1L(VSG1+VTH1).

(8)

The rising and falling time can be derived as

t=2.2ReqCL.

(9)
Figure  7.  (Color online) Simulated (a) delay time and (b) Q waveforms with VTH shift.

Due to the increase of T2's threshold voltage, there is increased charge leakage through T2 during the bootstrapping periods. Fig. 7(b) demonstrates the transient response of VQ with different VTH. It is proven that bootstrapping effects are deteriorated due to increased charge loss. Thus VSG1 will be decreased, and equivalent resistance of T1 will be increased according to Eq. (8). Consequently, rising and falling time will be increased according to Eq. (9).

In this paper, a new LTPS TFTs gate driver circuit with charge-sharing structure is proposed. Only one buffer TFT is used for pulling-down/pulling-up of gate scan line for the gate driver unit. Investigations show that voltage bootrapping can be maintained once C1 is larger than 0.8 pF. The proposed gate driver can still function properly with positive VTH shift within 0.4 V and negative VTH shift within-1.2 V. The pulse of gate driver outputs can be reduced to 5 μs. Therefore the proposed gate driver is robust and suitable for high resolution display.



[1]
Kim S Y, Roy K. A low-cost low-noise amplifier in poly-Si TFT technology. J Display Technol, 2014, 10(12): 1110 doi: 10.1109/JDT.2014.2351617
[2]
Sazonov A, Striakhilev D, Lee C H, et al. Low-temperature materials and thin film transistor flexible electronics. Proc IEEE, 2005, 93(8): 1420 doi: 10.1109/JPROC.2005.851497
[3]
Stewart M, Howell R S, Pires L, et al. Poly silicon TFT technology for active matrix OLED displays. IEEE Trans Electron Devices, 2001, 48(5): 845 doi: 10.1109/16.918227
[4]
Zhang Y W, Chen W B. A new LTPS TFT AC pixel circuit for an AMOLED. J Semicond, 2013, 34(1): 015009 doi: 10.1088/1674-4926/34/1/015009
[5]
Ayres J R, Brotherton S D, Mcculloch D J, et al. Analysis of drain field and hot carrier stability of poly-Si thin film transistors. Jpn J Appl Phys, 1998, 37(4A): 1801 doi: 10.1143/JJAP.37.1801/pdf
[6]
Uraoka Y, Hatayama T, Fuyuki T, et al. Reliability of low temperature poly-silicon TFTs under inverter operation. IEEE Trans Electron Devices, 2001, 48(10): 2370 doi: 10.1109/16.954479
[7]
Meng Z G, Kwok H S, Wu C Y, et al. Fabrication of a 125 mm poly-Si TFT active-matrix driving color AMOLED. J Semicond, 2006, 27(8): 1514 http://en.cnki.com.cn/Article_en/CJFDTOTAL-BDTX200608036.htm
[8]
Schropp R E I, Stannowski B, Rath J K. New challenges in thin film transistor (TFT) research. J Non-Cryst Solids, 2002, 302(01): 1304 http://cat.inist.fr/?aModele=afficheN&cpsidt=14187909
[9]
Lin C L, Tu C D, Wu C E, et al. Low-power gate driver circuit for TFT-LCD application. IEEE Trans Electron Devices, 2012, 59(5): 1410 doi: 10.1109/TED.2012.2186966
[10]
Ha Y M. P-type technology for large size low temperature poly-Si TFT-LCDs. SID'00 Digest, 2000: 1116 doi: 10.1889/1.1832861/abstract;jsessionid=72683787C5EAE246D45FFE224B7C03AB.f03t04
[11]
Song E, Nam H. Shoot-through current reduction scheme for low power LTPS TFT programmable shift register. J Soc Inform Display, 2014, 22(1): 18 doi: 10.1002/jsid.219
[12]
Song E, Kang B, Han I, et al. Depletion mode oxide TFT shift register for variable frame rate AMOLED displays. IEEE Electron Device Lett, 2015, 36(3): 247 doi: 10.1109/LED.2015.2388471
[13]
Song S J, Kim B H, Jang J, et al. Low power low temperature poly-Si thin-film transistor shift register with DC-type output driver. Solid-State Electron, 2015, 111: 204 doi: 10.1016/j.sse.2015.06.010
[14]
Lin C L, Chen F H, Ciou W C, et al. Simplified gate driver circuit for high-resolution and narrow-bezel thin-film transistor liquid crystal display applications. IEEE Electron Device Lett, 2015, 36(8): 808 doi: 10.1109/LED.2015.2450231
[15]
Lin C L, Cheng M H, Tu C D, et al. 2-D-3-D switchable gate driver circuit for TFT-LCD applications. IEEE Trans Electron Devices, 2014, 61(6): 2098 doi: 10.1109/TED.2014.2319096
[16]
Lin C L, Cheng M H, Tu C D, et al. Low-power a-Si:H gate driver circuit with threshold-voltage-shift recovery and synchronously controlled pull-down scheme. IEEE Trans Electron Devices, 2015, 62(1): 136 doi: 10.1109/TED.2014.2372820
[17]
Song E, Nam H. Low power programmable shift register with depletion mode oxide TFTs for high resolution, and high frame rate AMFPDs. J Display Technol, 2014, 10(10): 834 https://www.osapublishing.org/jdt/abstract.cfm?uri=jdt-10-10-834
[18]
Jung S H, Kang S H, Song I H, et al. 2 clock shift register by employing p-type poly-Si TFTs for active matrix displays. ASID, 2002, 2002: 2 http://en.cnki.com.cn/Article_en/CJFDTOTAL-DZQJ200801020.htm
[19]
Chu L W, Liu P T, Ker M D. Design of integrated gate driver with threshold voltage drop cancellation in amorphous silicon technology for TFT-LCD application. J Display Technol, 2011, 7(12): 657 doi: 10.1109/JDT.2011.2162937
Fig. 1.  (Color online) The conventional gate driver with schematic of (a) single stage and (b) timing diagram.

Fig. 2.  The proposed integrated gate driver with (a) block diagram, (b) schematic for single stage gate driver, and (c) timing diagram.

Fig. 3.  (Color online) The IV curve of LTPS TFT with the RPI model and measurement.

Fig. 4.  (Color online) The transient response of the proposed gate driver unit.

Fig. 5.  (Color online) The transient response of OUT[n] with pulse width of 5 μs.

Fig. 6.  (Color online) Simulated waveforms of Q, P and OUT[n] with the increase of C1.

Fig. 7.  (Color online) Simulated (a) delay time and (b) Q waveforms with VTH shift.

Table 1.   Device parameters of LTPS TFT.

Table 2.   Device parameters of the integrated gate driver.

[1]
Kim S Y, Roy K. A low-cost low-noise amplifier in poly-Si TFT technology. J Display Technol, 2014, 10(12): 1110 doi: 10.1109/JDT.2014.2351617
[2]
Sazonov A, Striakhilev D, Lee C H, et al. Low-temperature materials and thin film transistor flexible electronics. Proc IEEE, 2005, 93(8): 1420 doi: 10.1109/JPROC.2005.851497
[3]
Stewart M, Howell R S, Pires L, et al. Poly silicon TFT technology for active matrix OLED displays. IEEE Trans Electron Devices, 2001, 48(5): 845 doi: 10.1109/16.918227
[4]
Zhang Y W, Chen W B. A new LTPS TFT AC pixel circuit for an AMOLED. J Semicond, 2013, 34(1): 015009 doi: 10.1088/1674-4926/34/1/015009
[5]
Ayres J R, Brotherton S D, Mcculloch D J, et al. Analysis of drain field and hot carrier stability of poly-Si thin film transistors. Jpn J Appl Phys, 1998, 37(4A): 1801 doi: 10.1143/JJAP.37.1801/pdf
[6]
Uraoka Y, Hatayama T, Fuyuki T, et al. Reliability of low temperature poly-silicon TFTs under inverter operation. IEEE Trans Electron Devices, 2001, 48(10): 2370 doi: 10.1109/16.954479
[7]
Meng Z G, Kwok H S, Wu C Y, et al. Fabrication of a 125 mm poly-Si TFT active-matrix driving color AMOLED. J Semicond, 2006, 27(8): 1514 http://en.cnki.com.cn/Article_en/CJFDTOTAL-BDTX200608036.htm
[8]
Schropp R E I, Stannowski B, Rath J K. New challenges in thin film transistor (TFT) research. J Non-Cryst Solids, 2002, 302(01): 1304 http://cat.inist.fr/?aModele=afficheN&cpsidt=14187909
[9]
Lin C L, Tu C D, Wu C E, et al. Low-power gate driver circuit for TFT-LCD application. IEEE Trans Electron Devices, 2012, 59(5): 1410 doi: 10.1109/TED.2012.2186966
[10]
Ha Y M. P-type technology for large size low temperature poly-Si TFT-LCDs. SID'00 Digest, 2000: 1116 doi: 10.1889/1.1832861/abstract;jsessionid=72683787C5EAE246D45FFE224B7C03AB.f03t04
[11]
Song E, Nam H. Shoot-through current reduction scheme for low power LTPS TFT programmable shift register. J Soc Inform Display, 2014, 22(1): 18 doi: 10.1002/jsid.219
[12]
Song E, Kang B, Han I, et al. Depletion mode oxide TFT shift register for variable frame rate AMOLED displays. IEEE Electron Device Lett, 2015, 36(3): 247 doi: 10.1109/LED.2015.2388471
[13]
Song S J, Kim B H, Jang J, et al. Low power low temperature poly-Si thin-film transistor shift register with DC-type output driver. Solid-State Electron, 2015, 111: 204 doi: 10.1016/j.sse.2015.06.010
[14]
Lin C L, Chen F H, Ciou W C, et al. Simplified gate driver circuit for high-resolution and narrow-bezel thin-film transistor liquid crystal display applications. IEEE Electron Device Lett, 2015, 36(8): 808 doi: 10.1109/LED.2015.2450231
[15]
Lin C L, Cheng M H, Tu C D, et al. 2-D-3-D switchable gate driver circuit for TFT-LCD applications. IEEE Trans Electron Devices, 2014, 61(6): 2098 doi: 10.1109/TED.2014.2319096
[16]
Lin C L, Cheng M H, Tu C D, et al. Low-power a-Si:H gate driver circuit with threshold-voltage-shift recovery and synchronously controlled pull-down scheme. IEEE Trans Electron Devices, 2015, 62(1): 136 doi: 10.1109/TED.2014.2372820
[17]
Song E, Nam H. Low power programmable shift register with depletion mode oxide TFTs for high resolution, and high frame rate AMFPDs. J Display Technol, 2014, 10(10): 834 https://www.osapublishing.org/jdt/abstract.cfm?uri=jdt-10-10-834
[18]
Jung S H, Kang S H, Song I H, et al. 2 clock shift register by employing p-type poly-Si TFTs for active matrix displays. ASID, 2002, 2002: 2 http://en.cnki.com.cn/Article_en/CJFDTOTAL-DZQJ200801020.htm
[19]
Chu L W, Liu P T, Ker M D. Design of integrated gate driver with threshold voltage drop cancellation in amorphous silicon technology for TFT-LCD application. J Display Technol, 2011, 7(12): 657 doi: 10.1109/JDT.2011.2162937
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6. Ke, J., Deng, L., Zhen, L. et al. An AMOLED pixel circuit based on ltps thin-film transistors with mono-type scanning driving. Electronics (Switzerland), 2020, 9(4): 574. doi:10.3390/electronics9040574
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    Meng Chen, Jiefeng Lei, Shengxiang Huang, Congwei Liao, Lianwen Deng. Poly-Si TFTs integrated gate driver circuit with charge-sharing structure[J]. Journal of Semiconductors, 2017, 38(5): 055001. doi: 10.1088/1674-4926/38/5/055001
    M Chen, J F Lei, S X Huang, C W Liao, L W Deng. Poly-Si TFTs integrated gate driver circuit with charge-sharing structure[J]. J. Semicond., 2017, 38(5): 055001. doi: 10.1088/1674-4926/38/5/055001.
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    Received: 30 August 2016 Revised: 10 October 2016 Online: Published: 01 May 2017

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      Meng Chen, Jiefeng Lei, Shengxiang Huang, Congwei Liao, Lianwen Deng. Poly-Si TFTs integrated gate driver circuit with charge-sharing structure[J]. Journal of Semiconductors, 2017, 38(5): 055001. doi: 10.1088/1674-4926/38/5/055001 ****M Chen, J F Lei, S X Huang, C W Liao, L W Deng. Poly-Si TFTs integrated gate driver circuit with charge-sharing structure[J]. J. Semicond., 2017, 38(5): 055001. doi: 10.1088/1674-4926/38/5/055001.
      Citation:
      Meng Chen, Jiefeng Lei, Shengxiang Huang, Congwei Liao, Lianwen Deng. Poly-Si TFTs integrated gate driver circuit with charge-sharing structure[J]. Journal of Semiconductors, 2017, 38(5): 055001. doi: 10.1088/1674-4926/38/5/055001 ****
      M Chen, J F Lei, S X Huang, C W Liao, L W Deng. Poly-Si TFTs integrated gate driver circuit with charge-sharing structure[J]. J. Semicond., 2017, 38(5): 055001. doi: 10.1088/1674-4926/38/5/055001.

      Poly-Si TFTs integrated gate driver circuit with charge-sharing structure

      DOI: 10.1088/1674-4926/38/5/055001
      Funds:

      the Science and Technology Project of Hunan Province, China No.2015JC3401

      Project supported by the Science and Technology Project of Hunan Province, China (No.2015JC3401)

      More Information
      • Corresponding author: Liao Congwei, Email: 289114489@qq.com
      • Received Date: 2016-08-30
      • Revised Date: 2016-10-10
      • Published Date: 2017-05-01

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