Design of a 3D Wilkinson power divider using through glass via technology

Jifei Sang; Libo Qian; Yinshui Xia; Huakang Xia

doi:10.1088/1674-4926/39/12/125007

J. Semicond. > 2018, Volume 39 > Issue 12 > 125007

SEMICONDUCTOR INTEGRATED CIRCUITS

Design of a 3D Wilkinson power divider using through glass via technology

Jifei Sang, Libo Qian, Yinshui Xia and Huakang Xia

+ Author Affiliations

Corresponding author: Libo Qian, Email: qianlibo@nbu.edu.cn

DOI: 10.1088/1674-4926/39/12/125007

Abstract: Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study, through glass vias (TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed. Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.

Key words: 3D integration, glass interposer, through glass vias, power divider

References

[1]	Zhang R, Jeffery C C, Lee W R. Design and fabrication of a silicon interposer with TSVs in cavities for three dimensional IC packaging. IEEE Trans Device Mater Reliab, 2012, 12(2): 189 doi: 10.1109/TDMR.2012.2190764
[2]	Yin X, Zhu Z, Yang Y, et al. Effectiveness of p+ layer in mitigating substrate noise induced by through silicon via for microwave applications. IEEE Microwave Wireless Compon Lett, 2016, 26(9): 687 doi: 10.1109/LMWC.2016.2597218
[3]	Wang F, Zhu Z, Yang Y, et al. An effective approach of reducing the keep out zone induced by coaxial through silicon via. IEEE Trans Electron Devices, 2014, 61(8): 2928 doi: 10.1109/TED.2014.2330838
[4]	Lu J Q. 3-D hyper integration and packaging technologies for mico-nanosystems. Proc IEEE, 2009, 97(1): 18 doi: 10.1109/JPROC.2008.2007458
[5]	Lee S, Chen K. Development of bump less stacking with bottom-up TSV fabrication. IEEE Trans Electron Devices, 2017, 64(4): 1660 doi: 10.1109/TED.2017.2657324
[6]	Sukumaran V, Bandyopadhyay T, Sundaram V, et al. Low cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3D ICs. IEEE Trans Compon, Pack Manuf Technol, 2012, 2(9): 1426 doi: 10.1109/TCPMT.2012.2204392
[7]	Sukumaran V, Kumar G, Ramachandran K, et al. Design, fabrication and characterization of ultrathin 3-D glass interposers with through package vias at same pitch as TSVs in silicon. IEEE Trans Compon, Pack Manuf Technol, 2014, 4(5): 786 doi: 10.1109/TCPMT.2014.2303427
[8]	Li J, Wei X C, Li E P. Accurate field circuit hybrid modeling of high density through glass via arrays using perfect magnetic conductors and cylindrical mode expansion. IEEE Trans Compon, Pack Manuf Technol, 2016, 6(1): 100 doi: 10.1109/TCPMT.2015.2503362
[9]	Cho S, Sundaram V, Tummala R R, et al. Impact of copper through package vias on thermal performance of glass interposers. IEEE Trans Compon, Pack Manuf Technol, 2015, 5(8): 1075 doi: 10.1109/TCPMT.2015.2450731
[10]	Hsieh Y C, Chang Y S, Lee T C, et al. Characterization of through glass via (TGV) RF inductors. International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2016: 87
[11]	Kim J, Shenoy R, Lai K Y, et al. High-Q 3D RF solenoid inductors in glass. IEEE Radio Frequency Integrated Circuits Symposium, 2014: 199
[12]	Liu M, Wei X, Wang P, et al. Compact LTCC multilayer broadband power divider. International Conference on Computational Problem-Solving, 2011: 370
[13]	D M Pozar. Microwave engineering. 3rd ed. CA: John Wiley & Sons, 2005: 274
[14]	Yu T. A broadband Wilkinson power divider based on the segmented structure. IEEE Trans Microwave Theory Tech, 2018, 66(4): 1902 doi: 10.1109/TMTT.2018.2799579
[15]	Wang X, Takahashi K, Okamura S, et al. Generalized port separation dual-band Wilkinson power divider with series RLC components. Microwave Conference, 2011: 289
[16]	Manual of Advanced Design System v2016.01[Online]. Available: https://www.keysight.com/cn/zh/products/design-software.html
[17]	Krishnamurthy H K, Weng S, Mathew G E, et al. A 500 MHz, 68% efficient, fully on-die digitally controlled buck voltage regulator on 22 nm Tri-gate CMOS. VLSI Dig Tech Papers, 2014: 1
[18]	Manual of HFSS v15[Online]. Available: http://www.aonesoft.net/ansys/hfss.html
[19]	Yu T, Tsai J. Design of multi way power dividers including all connecting lines. IET Microwave, Antenna & Propagation, 2018, 12(8): 1367
[20]	Shao J, Huang S, Pang Y. Wilkinson power divider incorporating quasi-elliptic filters for improved out of band rejection. Electron Lett, 2011, 47(23): 1288 doi: 10.1049/el.2011.2766
[21]	Wu D, Li Y, Xue Q. Filtering power divider with harmonic suppression based on LTCC broadside coupling. Electron Lett, 2018, 54(11): 697 doi: 10.1049/el.2018.1025
[22]	Zhou B. Broadband and compact LTCC power divider. Electron Lett, 2015, 51(23): 1939 doi: 10.1049/el.2015.2265

Fig. 2. Equivalent circuit of the power divider at (a) even-mode excitation, (b) odd-mode excitation, (c) port 1 loaded with an excitation.

DownLoad: Full-Size Img PowerPoint

Fig. 3. (Color online) S parameters of the proposed power divider obtained with ADS simulator.

DownLoad: Full-Size Img PowerPoint

Fig. 1. Equivalent circuit of a lumped type Wilkinson power divider.

DownLoad: Full-Size Img PowerPoint

Fig. 4. (Color online) Layout of the proposed Wilkinson power divider.

DownLoad: Full-Size Img PowerPoint

Fig. 5. (Color online) (a) S parameters of the proposed power divider obtained with HFSS simulator. (b) Phase difference between the output ports obtained with ADS and HFSS simulator.

DownLoad: Full-Size Img PowerPoint

Table 1. Physical dimensions of each component.

Component	Size (μm³)
C₁	190 × 80 × 10.5
C₂	95 × 80 × 10.5
Z_c	300 × 200 × 80
L	230 × 550 × 165

DownLoad: CSV

Table 2. Performance comparison with some reported power dividers.

Ref	[19]	[20]	[21]	[22]	This work
Process	Micro-strip		LTCC		TGV
FBW (%)	100	5	13	180	10.51
N	2	1	1	7	1
f₀ (GHz)	1	2	3.7	2 – 38	2.95
S₁₁ (dB)	38	30	15	16	42
S₂₁ (dB)	6.45	6.4	4.45	4.3	3.1
S₃₂ (dB)	32	15	33	17	58
Size (mm²)	10.2 × 5.8	48 × 36.9	3.55 × 3.18	4 × 4	0.6 × 1.1

DownLoad: CSV

[1]	Zhang R, Jeffery C C, Lee W R. Design and fabrication of a silicon interposer with TSVs in cavities for three dimensional IC packaging. IEEE Trans Device Mater Reliab, 2012, 12(2): 189 doi: 10.1109/TDMR.2012.2190764
[2]	Yin X, Zhu Z, Yang Y, et al. Effectiveness of p+ layer in mitigating substrate noise induced by through silicon via for microwave applications. IEEE Microwave Wireless Compon Lett, 2016, 26(9): 687 doi: 10.1109/LMWC.2016.2597218
[3]	Wang F, Zhu Z, Yang Y, et al. An effective approach of reducing the keep out zone induced by coaxial through silicon via. IEEE Trans Electron Devices, 2014, 61(8): 2928 doi: 10.1109/TED.2014.2330838
[4]	Lu J Q. 3-D hyper integration and packaging technologies for mico-nanosystems. Proc IEEE, 2009, 97(1): 18 doi: 10.1109/JPROC.2008.2007458
[5]	Lee S, Chen K. Development of bump less stacking with bottom-up TSV fabrication. IEEE Trans Electron Devices, 2017, 64(4): 1660 doi: 10.1109/TED.2017.2657324
[6]	Sukumaran V, Bandyopadhyay T, Sundaram V, et al. Low cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3D ICs. IEEE Trans Compon, Pack Manuf Technol, 2012, 2(9): 1426 doi: 10.1109/TCPMT.2012.2204392
[7]	Sukumaran V, Kumar G, Ramachandran K, et al. Design, fabrication and characterization of ultrathin 3-D glass interposers with through package vias at same pitch as TSVs in silicon. IEEE Trans Compon, Pack Manuf Technol, 2014, 4(5): 786 doi: 10.1109/TCPMT.2014.2303427
[8]	Li J, Wei X C, Li E P. Accurate field circuit hybrid modeling of high density through glass via arrays using perfect magnetic conductors and cylindrical mode expansion. IEEE Trans Compon, Pack Manuf Technol, 2016, 6(1): 100 doi: 10.1109/TCPMT.2015.2503362
[9]	Cho S, Sundaram V, Tummala R R, et al. Impact of copper through package vias on thermal performance of glass interposers. IEEE Trans Compon, Pack Manuf Technol, 2015, 5(8): 1075 doi: 10.1109/TCPMT.2015.2450731
[10]	Hsieh Y C, Chang Y S, Lee T C, et al. Characterization of through glass via (TGV) RF inductors. International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2016: 87
[11]	Kim J, Shenoy R, Lai K Y, et al. High-Q 3D RF solenoid inductors in glass. IEEE Radio Frequency Integrated Circuits Symposium, 2014: 199
[12]	Liu M, Wei X, Wang P, et al. Compact LTCC multilayer broadband power divider. International Conference on Computational Problem-Solving, 2011: 370
[13]	D M Pozar. Microwave engineering. 3rd ed. CA: John Wiley & Sons, 2005: 274
[14]	Yu T. A broadband Wilkinson power divider based on the segmented structure. IEEE Trans Microwave Theory Tech, 2018, 66(4): 1902 doi: 10.1109/TMTT.2018.2799579
[15]	Wang X, Takahashi K, Okamura S, et al. Generalized port separation dual-band Wilkinson power divider with series RLC components. Microwave Conference, 2011: 289
[16]	Manual of Advanced Design System v2016.01[Online]. Available: https://www.keysight.com/cn/zh/products/design-software.html
[17]	Krishnamurthy H K, Weng S, Mathew G E, et al. A 500 MHz, 68% efficient, fully on-die digitally controlled buck voltage regulator on 22 nm Tri-gate CMOS. VLSI Dig Tech Papers, 2014: 1
[18]	Manual of HFSS v15[Online]. Available: http://www.aonesoft.net/ansys/hfss.html
[19]	Yu T, Tsai J. Design of multi way power dividers including all connecting lines. IET Microwave, Antenna & Propagation, 2018, 12(8): 1367
[20]	Shao J, Huang S, Pang Y. Wilkinson power divider incorporating quasi-elliptic filters for improved out of band rejection. Electron Lett, 2011, 47(23): 1288 doi: 10.1049/el.2011.2766
[21]	Wu D, Li Y, Xue Q. Filtering power divider with harmonic suppression based on LTCC broadside coupling. Electron Lett, 2018, 54(11): 697 doi: 10.1049/el.2018.1025
[22]	Zhou B. Broadband and compact LTCC power divider. Electron Lett, 2015, 51(23): 1939 doi: 10.1049/el.2015.2265

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Received: 15 June 2018 Revised: 15 July 2018 Online: Uncorrected proof: 13 September 2018Published: 13 December 2018

Article Navigation > Journal of Semiconductors > 2018 > 39(12): 125007

Jifei Sang, Libo Qian, Yinshui Xia, Huakang Xia. Design of a 3D Wilkinson power divider using through glass via technology[J]. Journal of Semiconductors, 2018, 39(12): 125007. doi: 10.1088/1674-4926/39/12/125007 ****J F Sang, L B Qian, Y S Xia, H K Xia, Design of a 3D Wilkinson power divider using through glass via technology[J]. J. Semicond., 2018, 39(12): 125007. doi: 10.1088/1674-4926/39/12/125007.

Citation:

Jifei Sang, Libo Qian, Yinshui Xia, Huakang Xia. Design of a 3D Wilkinson power divider using through glass via technology[J]. Journal of Semiconductors, 2018, 39(12): 125007. doi: 10.1088/1674-4926/39/12/125007 ****

J F Sang, L B Qian, Y S Xia, H K Xia, Design of a 3D Wilkinson power divider using through glass via technology[J]. J. Semicond., 2018, 39(12): 125007. doi: 10.1088/1674-4926/39/12/125007.

Citation:

J F Sang, L B Qian, Y S Xia, H K Xia, Design of a 3D Wilkinson power divider using through glass via technology[J]. J. Semicond., 2018, 39(12): 125007. doi: 10.1088/1674-4926/39/12/125007.

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Design of a 3D Wilkinson power divider using through glass via technology

DOI: 10.1088/1674-4926/39/12/125007

Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo 315211, China

Funds:

Projected supported by the National Natural Science Foundation of China (Nos. 61771268, 61571248, U1709218), the Science and Technology Fund of Zhejiang Province (No. 2015C31090), the Natural Science Foundation of Zhejiang (No. LY17F040002), and the K. C. Wong Magna Fund in Ningbo University.

More Information

Corresponding author: Email: qianlibo@nbu.edu.cn
Received Date: 2018-06-15
Revised Date: 2018-07-15
Published Date: 2018-12-01

Abstract

Abstract

Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study, through glass vias (TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed. Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.
- 3D integration,
- glass interposer,
- through glass vias,
- power divider

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References(22)

References

[1]	Zhang R, Jeffery C C, Lee W R. Design and fabrication of a silicon interposer with TSVs in cavities for three dimensional IC packaging. IEEE Trans Device Mater Reliab, 2012, 12(2): 189 doi: 10.1109/TDMR.2012.2190764
[2]	Yin X, Zhu Z, Yang Y, et al. Effectiveness of p+ layer in mitigating substrate noise induced by through silicon via for microwave applications. IEEE Microwave Wireless Compon Lett, 2016, 26(9): 687 doi: 10.1109/LMWC.2016.2597218
[3]	Wang F, Zhu Z, Yang Y, et al. An effective approach of reducing the keep out zone induced by coaxial through silicon via. IEEE Trans Electron Devices, 2014, 61(8): 2928 doi: 10.1109/TED.2014.2330838
[4]	Lu J Q. 3-D hyper integration and packaging technologies for mico-nanosystems. Proc IEEE, 2009, 97(1): 18 doi: 10.1109/JPROC.2008.2007458
[5]	Lee S, Chen K. Development of bump less stacking with bottom-up TSV fabrication. IEEE Trans Electron Devices, 2017, 64(4): 1660 doi: 10.1109/TED.2017.2657324
[6]	Sukumaran V, Bandyopadhyay T, Sundaram V, et al. Low cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3D ICs. IEEE Trans Compon, Pack Manuf Technol, 2012, 2(9): 1426 doi: 10.1109/TCPMT.2012.2204392
[7]	Sukumaran V, Kumar G, Ramachandran K, et al. Design, fabrication and characterization of ultrathin 3-D glass interposers with through package vias at same pitch as TSVs in silicon. IEEE Trans Compon, Pack Manuf Technol, 2014, 4(5): 786 doi: 10.1109/TCPMT.2014.2303427
[8]	Li J, Wei X C, Li E P. Accurate field circuit hybrid modeling of high density through glass via arrays using perfect magnetic conductors and cylindrical mode expansion. IEEE Trans Compon, Pack Manuf Technol, 2016, 6(1): 100 doi: 10.1109/TCPMT.2015.2503362
[9]	Cho S, Sundaram V, Tummala R R, et al. Impact of copper through package vias on thermal performance of glass interposers. IEEE Trans Compon, Pack Manuf Technol, 2015, 5(8): 1075 doi: 10.1109/TCPMT.2015.2450731
[10]	Hsieh Y C, Chang Y S, Lee T C, et al. Characterization of through glass via (TGV) RF inductors. International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2016: 87
[11]	Kim J, Shenoy R, Lai K Y, et al. High-Q 3D RF solenoid inductors in glass. IEEE Radio Frequency Integrated Circuits Symposium, 2014: 199
[12]	Liu M, Wei X, Wang P, et al. Compact LTCC multilayer broadband power divider. International Conference on Computational Problem-Solving, 2011: 370
[13]	D M Pozar. Microwave engineering. 3rd ed. CA: John Wiley & Sons, 2005: 274
[14]	Yu T. A broadband Wilkinson power divider based on the segmented structure. IEEE Trans Microwave Theory Tech, 2018, 66(4): 1902 doi: 10.1109/TMTT.2018.2799579
[15]	Wang X, Takahashi K, Okamura S, et al. Generalized port separation dual-band Wilkinson power divider with series RLC components. Microwave Conference, 2011: 289
[16]	Manual of Advanced Design System v2016.01[Online]. Available: https://www.keysight.com/cn/zh/products/design-software.html
[17]	Krishnamurthy H K, Weng S, Mathew G E, et al. A 500 MHz, 68% efficient, fully on-die digitally controlled buck voltage regulator on 22 nm Tri-gate CMOS. VLSI Dig Tech Papers, 2014: 1
[18]	Manual of HFSS v15[Online]. Available: http://www.aonesoft.net/ansys/hfss.html
[19]	Yu T, Tsai J. Design of multi way power dividers including all connecting lines. IET Microwave, Antenna & Propagation, 2018, 12(8): 1367
[20]	Shao J, Huang S, Pang Y. Wilkinson power divider incorporating quasi-elliptic filters for improved out of band rejection. Electron Lett, 2011, 47(23): 1288 doi: 10.1049/el.2011.2766
[21]	Wu D, Li Y, Xue Q. Filtering power divider with harmonic suppression based on LTCC broadside coupling. Electron Lett, 2018, 54(11): 697 doi: 10.1049/el.2018.1025
[22]	Zhou B. Broadband and compact LTCC power divider. Electron Lett, 2015, 51(23): 1939 doi: 10.1049/el.2015.2265

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