Chin. J. Semicond. > 2005, Volume 26 > Issue 1 > 106-110

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Abstract: 对100mm In0.49Ga0.51P/GaAs HBT器件及相关电路制备中的In0.49Ga0.51P腐蚀问题、聚酰亚胺平面化、空气桥等几项关键工艺进行了研究,解决了器件及电路制备过程中出现的难题,尤其是用很简单的方法解决了In0.49Ga0.51P腐蚀过程中经常出现的腐蚀“岛”问题,并且成功地制作出所设计的器件及电路.

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    Received: 19 August 2015 Revised: Online: Published: 01 January 2005

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      石瑞英, 孙海锋, 刘训春, 刘洪民. 100mm InGaP/GaAs HBT及相关电路关键工艺[J]. Journal of Semiconductors, 2005, 26(1): 106-110. ****石瑞英, 孙海锋, 刘训春, 刘洪民, 100mm InGaP/GaAs HBT及相关电路关键工艺[J]. Journal of Semiconductors, 2005, 26(1), 106-110
      Citation:
      石瑞英, 孙海锋, 刘训春, 刘洪民. 100mm InGaP/GaAs HBT及相关电路关键工艺[J]. Journal of Semiconductors, 2005, 26(1): 106-110. ****
      石瑞英, 孙海锋, 刘训春, 刘洪民, 100mm InGaP/GaAs HBT及相关电路关键工艺[J]. Journal of Semiconductors, 2005, 26(1), 106-110

      100mm InGaP/GaAs HBT及相关电路关键工艺

      • Received Date: 2015-08-19

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