Chin. J. Semicond. > 2002, Volume 23 > Issue 6 > 561-564

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退火过程中自组织生长

胡冬枝 , 杨建树 , 蔡群 , 张翔九 , 胡际璜 and 蒋最敏

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Key words: 量子点, 硅基材料, 形貌评价, AFM

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    Received: 19 August 2015 Revised: Online: Published: 01 June 2002

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      Article Navigation >  Journal of Semiconductors  > 2002  >  23(6): 561-564
      胡冬枝, 杨建树, 蔡群, 张翔九, 胡际璜, 蒋最敏. 退火过程中自组织生长[J]. 半导体学报(英文版), 2002, 23(6): 561-564.
      Citation:
      胡冬枝, 杨建树, 蔡群, 张翔九, 胡际璜, 蒋最敏. 退火过程中自组织生长[J]. 半导体学报(英文版), 2002, 23(6): 561-564.
      shu

      • Received Date: 2015-08-19

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