Chin. J. Semicond. > 2006, Volume 27 > Issue 9 > 1604-1607

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Fabrication of a New-Layout InGaP/GaAs HBT

Yang Wei, Liu Xunchun, 朱旻, Zhu Min and Wang Runmei

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Abstract: The HBT is one of the most important devices in microwave and millimeter wave fields due to its outstanding performance and high reliability.A novel-layout HBT that employs a three-finger emitter is demonstrated.Compared to an HBT with a two-finger emitter,this device has good process tolerance,high yield,and good uniformity.Furthermore,it has superior DC and high-frequency characteristics.

Key words: HBTthree-finger emitterself-aligned

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    Received: 18 August 2015 Revised: 05 June 2006 Online: Published: 01 September 2006

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      Yang Wei, Liu Xunchun, 朱旻, Zhu Min, Wang Runmei. Fabrication of a New-Layout InGaP/GaAs HBT[J]. Journal of Semiconductors, 2006, 27(9): 1604-1607. ****Yang W, Liu X C, Zhu M, Wang R M. Fabrication of a New-Layout InGaP/GaAs HBT[J]. Chin. J. Semicond., 2006, 27(9): 1604.
      Citation:
      Yang Wei, Liu Xunchun, 朱旻, Zhu Min, Wang Runmei. Fabrication of a New-Layout InGaP/GaAs HBT[J]. Journal of Semiconductors, 2006, 27(9): 1604-1607. ****
      Yang W, Liu X C, Zhu M, Wang R M. Fabrication of a New-Layout InGaP/GaAs HBT[J]. Chin. J. Semicond., 2006, 27(9): 1604.

      Fabrication of a New-Layout InGaP/GaAs HBT

      • Received Date: 2015-08-18
      • Accepted Date: 2006-02-17
      • Revised Date: 2006-06-05
      • Published Date: 2006-10-12

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