Chin. J. Semicond. > 2006, Volume 27 > Issue 1 > 150-155
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A MEMS Based Focus Plane Array for Infrared Imaging

Li Chaobo, Jiao Binbin, Shi Shali, Ye Tianchun, Chen Dapeng, Zhang Qingchuan, Guo Zheying, Dong Fengliang and Wu Xiaoping

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Abstract: Based on the opto-mechanical effect and MEMS technology,a novel substrate-free FPA with a thermally isolated structure for uncooled infrared imaging is developed.Alternately evaporating Au on a SiNx cantilever is used for thermal isolation.A human’s thermal image is obtained successfully using the infrared imaging system composed of the FPA and optical detection system.Experimental results show that the realization of thermal isolation in the substrate-free FPA increases the temperature of the deflecting leg effectively,while the NETD is about 200mK.

Key words: MEMS, FPA, opto-mechanical, LPCVD, SiNx, NETD

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    Received: 20 August 2015 Revised: Online: Published: 01 January 2006

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      Article Navigation >  Journal of Semiconductors  > 2006  >  27(1): 150-155
      Li Chaobo, Jiao Binbin, Shi Shali, Ye Tianchun, Chen Dapeng, Zhang Qingchuan, Guo Zheying, Dong Fengliang, Wu Xiaoping. A MEMS Based Focus Plane Array for Infrared Imaging[J]. Journal of Semiconductors, 2006, 27(1): 150-155. ****Li C B, Jiao B B, Shi S L, Ye T C, Chen D P, Zhang Q C, Guo Z Y, Dong F L, Wu X P. A MEMS Based Focus Plane Array for Infrared Imaging[J]. Chin. J. Semicond., 2006, 27(1): 150.
      Citation:
      Li Chaobo, Jiao Binbin, Shi Shali, Ye Tianchun, Chen Dapeng, Zhang Qingchuan, Guo Zheying, Dong Fengliang, Wu Xiaoping. A MEMS Based Focus Plane Array for Infrared Imaging[J]. Journal of Semiconductors, 2006, 27(1): 150-155. ****
      Li C B, Jiao B B, Shi S L, Ye T C, Chen D P, Zhang Q C, Guo Z Y, Dong F L, Wu X P. A MEMS Based Focus Plane Array for Infrared Imaging[J]. Chin. J. Semicond., 2006, 27(1): 150.
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      A MEMS Based Focus Plane Array for Infrared Imaging

      • Micro-Processing and Nano-Technology Department,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China

      • Micro-Processing and Nano-Technology Department,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China

      • Micro-Processing and Nano-Technology Department,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China

      • Micro-Processing and Nano-Technology Department,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China

      • Micro-Processing and Nano-Technology Department,Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China

      • Key Laboratory of Mechanical Behavior and Design of Materials,University of Science and Technology of China,Hefei 230027,China

      • Key Laboratory of Mechanical Behavior and Design of Materials,University of Science and Technology of China,Hefei 230027,China

      • Key Laboratory of Mechanical Behavior and Design of Materials,University of Science and Technology of China,Hefei 230027,China

      • Key Laboratory of Mechanical Behavior and Design of Materials,University of Science and Technology of China,Hefei 230027,China

      • Received Date: 2015-08-20

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