Chin. J. Semicond. > 1996, Volume 17 > Issue 5 > 386-391
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高组装密度器件的散热分析

王世萍，栾永卫，赵惇殳

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    Received: 18 August 2015 Revised: Online: Published: 01 May 1996

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      Article Navigation >  Journal of Semiconductors  > 1996  >  17(5): 386-391
      王世萍，栾永卫，赵惇殳. 高组装密度器件的散热分析[J]. 半导体学报(英文版), 1996, 17(5): 386-391.
      Citation:
      王世萍，栾永卫，赵惇殳. 高组装密度器件的散热分析[J]. 半导体学报(英文版), 1996, 17(5): 386-391.
      shu

      • Received Date: 2015-08-18

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