| Citation: |
Li Ming, Song Jing, Huang Qing’an, Tang Jieying. Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam[J]. Journal of Semiconductors, 2008, 29(1): 157-162.
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Li M, Song J, Huang Q, Tang J Y. Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam[J]. J. Semicond., 2008, 29(1): 157.
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Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam
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Abstract
To characterize the effect of deformation of die-bonding packages on the performance of MEMS devices,a laser scanning vibrometer was used,based on the theory of vibration analysis and signal processing.Because it is a commonly used structure in MEMS design,a surface micromachined polysilicon fixed-fixed beam was chosen.Its resonant frequencies from the 1st to the 3rd order were recorded before and after die bonding and compared to FEM simulations.The results suggest that the thermo-mechanical coupling deformation in the multilayer packaging structure affects the performance of MEMS device remarkably,and the resonant frequencies shift of the beam are more than 15%~30%.Therefore,it is possible to include the package effect in the primary design circle of MEMS devices,which may enhance the device performance and shorten the primary design cycle.-
Keywords:
- MEMS,
- packaging effect,
- fixed-fixed beam,
- resonant frequency,
- co-design
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References
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Proportional views
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