Chin. J. Semicond. > 2003, Volume 24 > Issue 7 > 737-742
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用于半导体激光器热沉的金刚石膜/Ti/Ni/Au金属化体系的研究

潘存海 , 李俊岳 , 花吉珍 and 王少岩

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Key words: 金刚石膜, 热沉, 金属化, 半导体激光器

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    Received: 20 August 2015 Revised: Online: Published: 01 July 2003

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      Article Navigation >  Journal of Semiconductors  > 2003  >  24(7): 737-742
      潘存海, 李俊岳, 花吉珍, 王少岩. 用于半导体激光器热沉的金刚石膜/Ti/Ni/Au金属化体系的研究[J]. 半导体学报(英文版), 2003, 24(7): 737-742.
      Citation:
      潘存海, 李俊岳, 花吉珍, 王少岩. 用于半导体激光器热沉的金刚石膜/Ti/Ni/Au金属化体系的研究[J]. 半导体学报(英文版), 2003, 24(7): 737-742.
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      • Received Date: 2015-08-20

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