Chin. J. Semicond. > 2000, Volume 21 > Issue 9 > 839-842
|

CONTENTS

Multiple Quantum Well SEED Arrays for Flip-Chip Bonding Optoelectronic Smart Pixels

陈弘达 , 陈志标 , 杜云 and 吴荣汉

+ Author Affiliations

PDF

Key words: Optoelectronic

    • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 2968 Times PDF downloads: 828 Times Cited by: 0 Times

    History

    Received: 20 August 2015 Revised: Online: Published: 01 September 2000

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 2000  >  21(9): 839-842
      陈弘达, 陈志标, 杜云, 吴荣汉. Multiple Quantum Well SEED Arrays for Flip-Chip Bonding Optoelectronic Smart Pixels[J]. 半导体学报(英文版), 2000, 21(9): 839-842.
      Citation:
      陈弘达, 陈志标, 杜云, 吴荣汉. Multiple Quantum Well SEED Arrays for Flip-Chip Bonding Optoelectronic Smart Pixels[J]. 半导体学报(英文版), 2000, 21(9): 839-842.
      shu

      • Received Date: 2015-08-20

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return