Abstract: Dynamical characteristics of transducer systems are the key to the basic understanding of metal interconnection and reliable fine pitch flip-chip bonding.Systematic experimental analysis clearly shows that rich phenomena and effects such as a Duffing resonator,dynamical coupling between the transducer and bonding tool,and strange phase portraits of die movement may be explained by the nonlinear features of a real world transducer system.It is possible to explore their mechanisms and effects on bonding quality by identifying and decoding them from experimental data

Key words: thermosonic bonding, PZT transducer system, nonlinear dynamics,flip-chip die, interconnection packaging, 封装互连