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Magnetron sputter and phase change optimization of wafer-level GeTe films for RF switch

Shihang Liu§, Hanxiang Jia§, , Shuangzan Lu, Changyu Hu and Jun Liu

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 Corresponding author: Hanxiang Jia, jiahanxiang@jfslab.com.cn; Jun Liu, liujun@jfslab.com.cn

DOI: 10.1088/1674-4926/24120033CSTR: 32376.14.1674-4926.24120033

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Abstract: With the rapid advancement of 5G communication technology, increasingly stringent demands are placed on the performance and functionality of phase change switches. Given that RF and microwave signals exhibit characteristics of high frequency, high speed, and high precision, it is imperative for phase change switches to possess fast, accurate, and reliable switching capabilities. Moreover, wafer-level compositional homogeneity and resistivity uniformity during semiconductor manufacturing are crucial for ensuring the yield and reliability of RF switches. By controlling magnetron sputter of GeTe through from four key parameters (power, Ar flow, pressure, and post-annealing) and incorporating elemental proportional compensation in the target, we achieved effective modulation over GeTe uniformity. Finally, we successfully demonstrated the process integration of GeTe phase-change RF switches on 6-inch scaled wafers.

Key words: GeTemagnetron sputterphase changein-wafer uniformityRF switch



[1]
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[2]
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[14]
Fu S S, Gao L B, Peng Y, et al. Novel four-port RF phase change switches based on GeTe thin film. J Micromech Microeng, 2023, 33(9), 095004 doi: 10.1088/1361-6439/acdfd8
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Li M, Xu S D, Lyu W Y, et al. Unravelling effective-medium transport and interfacial resistance in (CaTe)x(GeTe)100-x thermoelectrics. Chem Eng J, 2023, 452, 139269 doi: 10.1016/j.cej.2022.139269
[21]
Betti Beneventi G, Perniola L, Sousa V, et al. Carbon-doped GeTe: A promising material for phase-change memories. Solid State Electron, 2011, 65, 197 doi: 10.1016/j.sse.2011.06.029
[22]
Jeong K, Park S, Park D, et al. Evolution of crystal structures in GeTe during phase transition. Sci Rep, 2017, 7, 955 doi: 10.1038/s41598-017-01154-z
Fig. 1.  (Color online) Post-anneal Rs distribution of GeTe sputtered under different pressure: (a) 0.4 Pa; (b) 0.67 Pa; (c) 0.93 Pa; (d) 1.0 Pa.

Fig. 2.  (Color online) Post-anneal Rs distribution of GeTe under different power: (a) 60 W; (b) 70 W; (c) 80 W; (d) 100 W.

Fig. 3.  (Color online) Post-anneal Rs distribution of GeTe under different Ar flow: (a) 35 sccm; (b) 40 sccm; (c) 45 sccm; (d) 50 sccm.

Fig. 4.  (Color online) In-wafer thickness distribution of GeTe after annealing under different temperature: (a) 250 °C; (b) 300 °C; (c) 350 °C; (d) 400 °C.

Fig. 5.  (Color online) Microstructure characterization of GeTe after annealing based on optimal recipe: (a) cross-sectional TEM; (b)−(c) EDS mapping (Ge/Te ratio ≈ 1 : 1); (d) 3D AFM map.

Fig. 6.  (Color online) Phase change performance (a) XRD pattern. (b) The variable temperature resistance test.

Table 1.   GeTe sputter DOE.

ParameterS1S2S3S4
Pressure (Pa)0.40.670.931.0
Power (W)607080100
Ar flow (sccm)35404550
Element ratioGe50Te50 to Ge43Te57
Baseline recipe0.67 Pa, 70 W, 40 sccm
DownLoad: CSV
[1]
Elshazly A, Mounir M, Khalaf M K, et al. Design and simulation of a novel low-voltage RF MEMS switch for reconfigurable antennas. Advances in System-Integrated Intelligence. 6th International Conference on System-Integrated Intelligence (SysInt), 2022, 708 doi: 10.1007/978-3-031-16281-7_67
[2]
Deng Z L, Wang Y C, Lai C Q. Design and analysis of pattern reconfigurable antenna based on RF MEMS switches. Electronics, 2023, 12(14), 3109 doi: 10.3390/electronics12143109
[3]
Gu C, Fusco V, Zelenchuk D, et al. An active frequency selective surface with a PIN diode switching mechanism. 2023 17th European Conference on Antennas and Propagation (EuCAP), 2023, 1 doi: 10.23919/EuCAP57121.2023.10133500
[4]
Elluru D N, Awasthi A K, Gogineni S P, et al. Design of an absorptive high-power PIN diode switch for an ultra-wideband radar. IEEE J Microw, 2022, 2(2), 286 doi: 10.1109/JMW.2021.3138889
[5]
Zhu Z X, Tu C M, Xiao B, et al. Research on characteristics of SiC FET/Si IGBT and SiC MOSFET/Si IGBT hybrid switches. 2022 4th International Conference on Smart Power & Internet Energy Systems (SPIES), 2022, 1532 doi: 10.1109/spies55999.2022.10082437
[6]
Kim M S, Yun G J, Kim W K, et al. A steep-slope phenomenon by gate charge pumping in a MOSFET. IEEE Electron Device Lett, 2022, 43(4), 521 doi: 10.1109/LED.2022.3151077
[7]
De La Cruz L, Ivanov T, Birdwell A G, et al. Low energy transition of GeTe RF phase change switches. IEEE Trans Electron Devices, 2023, 70(8), 4178 doi: 10.1109/TED.2023.3289782
[8]
Charlet I, Reig B, Mercier C, et al. RF performance of large germanium telluride switches for power application. 2023 18th European Microwave Integrated Circuits Conference (EuMIC), 2023, 177 doi: 10.23919/EuMIC58042.2023.10288974
[9]
Tang C X, He C H, Li C Q, et al. Terahertz state switching of holograms enabled by vanadium dioxide-based metasurfaces. Phys Chem Chem Phys, 2023, 25(29), 19576 doi: 10.1039/D3CP02035E
[10]
Cui J H, Jiang Q W, Wang N, et al. Regulating the phase transition temperature of VO2 films via the combination of doping and strain methods. AIP Adv, 2023, 13(5), 055316 doi: 10.1063/5.0138303
[11]
Xu X H, Li M, Li S B, et al. The nanoscale electrical damage mechanism of Ge2Sb2Te5 phase-change films discovered by conductive atomic force microscopy. IEEE Electron Device Lett, 2023, 44(3), 488 doi: 10.1109/LED.2023.3237230
[12]
Parra J, Navarro-Arenas J, Kovylina M, et al. Impact of GST thickness on GST-loaded silicon waveguides for optimal optical switching. Sci Rep, 2022, 12(1), 9774 doi: 10.1038/s41598-022-13848-0
[13]
Le Gall N, Bettoumi I, Hallepee C, et al. Off-state stability of phase-change material RF-switches. 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022. Denver, CO, 2022, 963 doi: 10.1109/ims37962.2022.9865537
[14]
Fu S S, Gao L B, Peng Y, et al. Novel four-port RF phase change switches based on GeTe thin film. J Micromech Microeng, 2023, 33(9), 095004 doi: 10.1088/1361-6439/acdfd8
[15]
Seo H K, Ryu J J, Lee S Y, et al. Material and structural engineering of ovonic threshold switch for highly reliable performance. Adv Elect Materials, 2022, 8(9), 2200161 doi: 10.1002/aelm.202200161
[16]
Singh T, Hummel G, Vaseem M, et al. Recent advancements in reconfigurable mmWave devices based on phase-change and metal insulator transition materials. IEEE J Microw, 2023, 3(2), 827 doi: 10.1109/JMW.2023.3247360
[17]
Wang D N, Zhao L, Yu S Y, et al. Non-volatile tunable optics by design: From chalcogenide phase-change materials to device structures. Mater Today, 2023, 68, 334 doi: 10.1016/j.mattod.2023.08.001
[18]
Guo S, Zhang J Z, Wang Y F. In-situ Raman scattering study of nitrogen doped GeTe phase-change films. Mater Lett, 2023, 337, 133994 doi: 10.1016/j.matlet.2023.133994
[19]
Ansari S M, Taha I, Han X P, et al. Influence of molybdenum doping on the structural, electrical, and optical properties of germanium telluride thin films. J Mater Res Technol, 2023, 24, 2538 doi: 10.1016/j.jmrt.2023.03.172
[20]
Li M, Xu S D, Lyu W Y, et al. Unravelling effective-medium transport and interfacial resistance in (CaTe)x(GeTe)100-x thermoelectrics. Chem Eng J, 2023, 452, 139269 doi: 10.1016/j.cej.2022.139269
[21]
Betti Beneventi G, Perniola L, Sousa V, et al. Carbon-doped GeTe: A promising material for phase-change memories. Solid State Electron, 2011, 65, 197 doi: 10.1016/j.sse.2011.06.029
[22]
Jeong K, Park S, Park D, et al. Evolution of crystal structures in GeTe during phase transition. Sci Rep, 2017, 7, 955 doi: 10.1038/s41598-017-01154-z
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    Received: 24 December 2024 Revised: 22 January 2025 Online: Accepted Manuscript: 25 February 2025Uncorrected proof: 07 April 2025

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      Shihang Liu, Hanxiang Jia, Shuangzan Lu, Changyu Hu, Jun Liu. Magnetron sputter and phase change optimization of wafer-level GeTe films for RF switch[J]. Journal of Semiconductors, 2025, In Press. doi: 10.1088/1674-4926/24120033 ****S H Liu, H X Jia, S Z Lu, C Y Hu, and J Liu, Magnetron sputter and phase change optimization of wafer-level GeTe films for RF switch[J]. J. Semicond., 2025, 46(7), 072702 doi: 10.1088/1674-4926/24120033
      Citation:
      Shihang Liu, Hanxiang Jia, Shuangzan Lu, Changyu Hu, Jun Liu. Magnetron sputter and phase change optimization of wafer-level GeTe films for RF switch[J]. Journal of Semiconductors, 2025, In Press. doi: 10.1088/1674-4926/24120033 ****
      S H Liu, H X Jia, S Z Lu, C Y Hu, and J Liu, Magnetron sputter and phase change optimization of wafer-level GeTe films for RF switch[J]. J. Semicond., 2025, 46(7), 072702 doi: 10.1088/1674-4926/24120033

      Magnetron sputter and phase change optimization of wafer-level GeTe films for RF switch

      DOI: 10.1088/1674-4926/24120033
      CSTR: 32376.14.1674-4926.24120033
      More Information
      • Shihang Liu received his master's degree in June 2022 from Wuhan University of Technology. Then he joined JFS Laboratory in July 2022 as a thin film process engineer. His main research interests focus on the development of piezoelectric thin film processes
      • Hanxiang Jia got his PhD degree from University of Chinese Academy of Sciences in 2022. Then he joined JFS Laboratory in July 2022 as a thin film technology development senior engineer. His main research interest focuses on functional films including piezoelectric films, metal−semi contact, and phase change alloys
      • Jun Liu received his Ph.D. in electrical and electronic engineering from the City University of Hong Kong (2014). Dr. Liu join the Jiufengshan Laboratory (JFS) as director of process center and is now a professor of JFS. He mainly worked on compound semiconductor modeling, processing, and characterization
      • Corresponding author: jiahanxiang@jfslab.com.cnliujun@jfslab.com.cn
      • Received Date: 2024-12-24
      • Revised Date: 2025-01-22
      • Available Online: 2025-02-25

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