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Trends and emerging techniques in isolated power converters

Lin Cheng and Dongfang Pan

+ Author Affiliations

 Corresponding author: Dongfang Pan, pdf1992@ustc.edu.cn

DOI: 10.1088/1674-4926/25040037CSTR: 32376.14.1674-4926.25040037

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[1]
Chen B X. Isolation in digital power supplies using micro-transformers. 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition, 2009, 2039
[2]
Lombardo P, Fiore V, Ragonese E, et al. 16.7 A fully-integrated half-duplex data/power transfer system with up to 40Mb/s data rate, 23mW output power and on-chip 5kV galvanic isolation. 2016 IEEE International Solid-State Circuits Conference (ISSCC), 2016, 300
[3]
Ragonese E, Spina N, Castorina A, et al. A fully integrated galvanically isolated DC-DC converter with data communication. IEEE Trans Circuits Syst I Regul Pap, 2018, 65(4), 1432 doi: 10.1109/TCSI.2017.2742021
[4]
Fiore V, Ragonese E, Palmisano G. A fully integrated watt-level power transfer system with on-chip galvanic isolation in silicon technology. IEEE Trans Power Electron, 2017, 32(3), 1984 doi: 10.1109/TPEL.2016.2556939
[5]
Qin W H, Yang X, Ma S Y, et al. 15. 5 An 800mW Fully Integrated Galvanic Isolated Power Transfer System Meeting CISPR 22 Class-B Emission Levels with 6dB Margin2019 IEEE International Solid- State Circuits Conference - (ISSCC), 2019, 246
[6]
Zhuo Y, Ma S Y, Zhao T T, et al. 15. 4 A 52% Peak-Efficiency & gt; 1W Isolated Power Transfer System Using Fully Integrated Magnetic-Core Transformer2019 IEEE International Solid- State Circuits Conference - (ISSCC), 2019, 244
[7]
Zhuo Y, Ma S Y, Zhao T T, et al. A 52% peak efficiency > 1-W isolated power transfer system using fully integrated transformer with magnetic core. IEEE J Solid State Circuits, 2019, 54(12), 3326
[8]
Li L S, Fang X M, Wu R X. 18.4 An 11MHz Fully Integrated 5kV Isolated DC-DC Converter Without Cross-Isolation-Barrier Feedback. 2020 IEEE International Solid- State Circuits Conference - (ISSCC), 2020, 292
[9]
Pan D F, Li G L, Miao F T, et al. A 1.2W 51%-peak-efficiency isolated DC-DC converter with a cross-coupled shoot-through-free class-D oscillator meeting the CISPR-32 class-B EMI standard. 2022 IEEE International Solid-State Circuits Conference (ISSCC), 2022, 240
[10]
Pan D F, Li A Y, Sun W, et al. An isolated DC–DC converter using a cross-coupled shoot-through-free class-D oscillator with low EMI emissions. IEEE J Solid State Circuits, 2024, 59(10), 3457 doi: 10.1109/JSSC.2024.3407599
[11]
Pan D F, Xu W W, Zhang L T, et al. 32.5 A 2W 53.2%-peak-efficiency multi-core isolated DC-DC converter with embedded magnetic-core transformer achieving CISPR-32 class-B EMI compliance and <5mV ripple. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 536
[12]
Pan D F, Li G L, Miao F T, et al. 33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density. 2021 IEEE International Solid- State Circuits Conference (ISSCC), 2021, 468
[13]
Cheng L, Chen Z H, Yu D Q, et al. A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging. Fundam Res, 2024, 4(6), 1407 doi: 10.1016/j.fmre.2023.05.003
[14]
Xia T, Chen Q J, Wang S J, et al. 32.1 A 180MHz 45.3%-peak-efficiency isolated converter using Q-downsize class-D power amplifier with inherent shoot-through current blocking and high tolerance for efficiency despite frequency misalignments. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 1
[15]
Tang J Y, Zhao L, Huang C. A through-power-link hysteretic-controlled capacitive isolated DC–DC converter with enhanced efficiency and common-mode transient immunity. IEEE J Solid State Circuits, 2024, 59(5), 1543 doi: 10.1109/JSSC.2024.3359114
[16]
Jiang J Q, Tang J Y, Zhao L, et al. A 63% efficiency 1.29-W single-link multiple-output (SLiMO) isolated DC–DC converter using FPC micro-transformer with local voltage and global power regulations. IEEE J Solid State Circuits, 2024, 59(3), 804 doi: 10.1109/JSSC.2023.3330173
[17]
Jiang J Q, Tang J Y, Zhao L, et al. SLiMO: A 61.8% efficiency single-link multiple-output isolated DC-DC converter using low-cost FPC micro- transformer with local voltage and global power regulation. 2023 IEEE Custom Integrated Circuits Conference (CICC), 2023, 1
[18]
Tang J Y, Zhao L, Huang C. A 68.3% efficiency reconfigurable 400-/ 800-mW capacitive isolated DC-DC converter with common-mode transient immunity and fast dynamic response by through-power-link hysteretic control. 2022 IEEE International Solid-State Circuits Conference (ISSCC), 2022, 1
[19]
Liu Y, Yao Y, Cheng L, Ki W H. A pseudo hysteretic controlled gap time modulated isolated DC–DC converter with common-mode transient immunity. IEEE J Solid State Circuits, 2025, 60(3), 861-870. doi: 10.1109/JSSC.2024.3510362
[20]
Pan D F, Li A Y, Xu W W, et al. A 2.1W 60%-peak-efficiency isolated DC-DC converter with complementary edge-aligned and adaptive over-compensation techniques meeting the CISPR-32 class-B EMI standard. 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, 589
[21]
Huang Q A, Pan D F, Chen Z Y, et al. 32.4 A dual-LC-resonant isolated DC-DC converter achieving 65.4% peak efficiency and inherent backscattering. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 1
[22]
PMP22845, Isolated 5-V Bias Supply for Automotive CISPR 25, Class 5 Emissions. Texas Instruments. Reference Design, 2021 <https://www.ti.comlitughtidt223/tidt223.pdf>
[23]
Isolated 5-V Bias Supply for Automotive CISPR 25, Class 5 Emissions, Reference Design. Texas Instruments, 2021. <https://www.ti.com/lit/ug/tidt223/tidt223.pdf>
[24]
AN-0971, Recommendations for Control of Radiated Emissions with isoPower Device. Analog Devices, Inc. 2014. <https://www.analog.com/media/en/technical-documentation/application-notes/AN-0971.pdf>
[25]
Hu T X, Lu Y, Martins R P, et al. An isolated DC-DC converter with full-duplex communication using a single pair of transformers. IEEE J Solid State Circuits, 2025, 60(3), 1070 doi: 10.1109/JSSC.2024.3445316
[26]
Hu T X, Huang M, Martins R P, et al. 31.5 A 750mW, 37% peak efficiency isolated DC-DC converter with 54/18Mb/s full-duplex communication using a single pair of transformers. 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, 504
[27]
Jiang J Q, Zhao L, Tang J Y, et al. A single-link multi-domain-output (SLiMDO) isolated DC-DC converter with passive magnetic flux sharing for local energy distribution and Rx behavior sensing-based global power modulation. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 530
[28]
Pan D F, Xu W W, Wu X F, et al. A 24V-to-20V 6W 73.2%-peak-efficiency isolated DC-DC converter using a transformer-based supply-generating technique. 2024 IEEE Custom Integrated Circuits Conference (CICC), 2024, 1
Fig. 1.  (Color online) Recent advancements in isolated power converters: system architecture, representative transformer implementations, and EMI mitigation techniques.

[1]
Chen B X. Isolation in digital power supplies using micro-transformers. 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition, 2009, 2039
[2]
Lombardo P, Fiore V, Ragonese E, et al. 16.7 A fully-integrated half-duplex data/power transfer system with up to 40Mb/s data rate, 23mW output power and on-chip 5kV galvanic isolation. 2016 IEEE International Solid-State Circuits Conference (ISSCC), 2016, 300
[3]
Ragonese E, Spina N, Castorina A, et al. A fully integrated galvanically isolated DC-DC converter with data communication. IEEE Trans Circuits Syst I Regul Pap, 2018, 65(4), 1432 doi: 10.1109/TCSI.2017.2742021
[4]
Fiore V, Ragonese E, Palmisano G. A fully integrated watt-level power transfer system with on-chip galvanic isolation in silicon technology. IEEE Trans Power Electron, 2017, 32(3), 1984 doi: 10.1109/TPEL.2016.2556939
[5]
Qin W H, Yang X, Ma S Y, et al. 15. 5 An 800mW Fully Integrated Galvanic Isolated Power Transfer System Meeting CISPR 22 Class-B Emission Levels with 6dB Margin2019 IEEE International Solid- State Circuits Conference - (ISSCC), 2019, 246
[6]
Zhuo Y, Ma S Y, Zhao T T, et al. 15. 4 A 52% Peak-Efficiency & gt; 1W Isolated Power Transfer System Using Fully Integrated Magnetic-Core Transformer2019 IEEE International Solid- State Circuits Conference - (ISSCC), 2019, 244
[7]
Zhuo Y, Ma S Y, Zhao T T, et al. A 52% peak efficiency > 1-W isolated power transfer system using fully integrated transformer with magnetic core. IEEE J Solid State Circuits, 2019, 54(12), 3326
[8]
Li L S, Fang X M, Wu R X. 18.4 An 11MHz Fully Integrated 5kV Isolated DC-DC Converter Without Cross-Isolation-Barrier Feedback. 2020 IEEE International Solid- State Circuits Conference - (ISSCC), 2020, 292
[9]
Pan D F, Li G L, Miao F T, et al. A 1.2W 51%-peak-efficiency isolated DC-DC converter with a cross-coupled shoot-through-free class-D oscillator meeting the CISPR-32 class-B EMI standard. 2022 IEEE International Solid-State Circuits Conference (ISSCC), 2022, 240
[10]
Pan D F, Li A Y, Sun W, et al. An isolated DC–DC converter using a cross-coupled shoot-through-free class-D oscillator with low EMI emissions. IEEE J Solid State Circuits, 2024, 59(10), 3457 doi: 10.1109/JSSC.2024.3407599
[11]
Pan D F, Xu W W, Zhang L T, et al. 32.5 A 2W 53.2%-peak-efficiency multi-core isolated DC-DC converter with embedded magnetic-core transformer achieving CISPR-32 class-B EMI compliance and <5mV ripple. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 536
[12]
Pan D F, Li G L, Miao F T, et al. 33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density. 2021 IEEE International Solid- State Circuits Conference (ISSCC), 2021, 468
[13]
Cheng L, Chen Z H, Yu D Q, et al. A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging. Fundam Res, 2024, 4(6), 1407 doi: 10.1016/j.fmre.2023.05.003
[14]
Xia T, Chen Q J, Wang S J, et al. 32.1 A 180MHz 45.3%-peak-efficiency isolated converter using Q-downsize class-D power amplifier with inherent shoot-through current blocking and high tolerance for efficiency despite frequency misalignments. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 1
[15]
Tang J Y, Zhao L, Huang C. A through-power-link hysteretic-controlled capacitive isolated DC–DC converter with enhanced efficiency and common-mode transient immunity. IEEE J Solid State Circuits, 2024, 59(5), 1543 doi: 10.1109/JSSC.2024.3359114
[16]
Jiang J Q, Tang J Y, Zhao L, et al. A 63% efficiency 1.29-W single-link multiple-output (SLiMO) isolated DC–DC converter using FPC micro-transformer with local voltage and global power regulations. IEEE J Solid State Circuits, 2024, 59(3), 804 doi: 10.1109/JSSC.2023.3330173
[17]
Jiang J Q, Tang J Y, Zhao L, et al. SLiMO: A 61.8% efficiency single-link multiple-output isolated DC-DC converter using low-cost FPC micro- transformer with local voltage and global power regulation. 2023 IEEE Custom Integrated Circuits Conference (CICC), 2023, 1
[18]
Tang J Y, Zhao L, Huang C. A 68.3% efficiency reconfigurable 400-/ 800-mW capacitive isolated DC-DC converter with common-mode transient immunity and fast dynamic response by through-power-link hysteretic control. 2022 IEEE International Solid-State Circuits Conference (ISSCC), 2022, 1
[19]
Liu Y, Yao Y, Cheng L, Ki W H. A pseudo hysteretic controlled gap time modulated isolated DC–DC converter with common-mode transient immunity. IEEE J Solid State Circuits, 2025, 60(3), 861-870. doi: 10.1109/JSSC.2024.3510362
[20]
Pan D F, Li A Y, Xu W W, et al. A 2.1W 60%-peak-efficiency isolated DC-DC converter with complementary edge-aligned and adaptive over-compensation techniques meeting the CISPR-32 class-B EMI standard. 2024 IEEE European Solid-State Electronics Research Conference (ESSERC), 2024, 589
[21]
Huang Q A, Pan D F, Chen Z Y, et al. 32.4 A dual-LC-resonant isolated DC-DC converter achieving 65.4% peak efficiency and inherent backscattering. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 1
[22]
PMP22845, Isolated 5-V Bias Supply for Automotive CISPR 25, Class 5 Emissions. Texas Instruments. Reference Design, 2021 <https://www.ti.comlitughtidt223/tidt223.pdf>
[23]
Isolated 5-V Bias Supply for Automotive CISPR 25, Class 5 Emissions, Reference Design. Texas Instruments, 2021. <https://www.ti.com/lit/ug/tidt223/tidt223.pdf>
[24]
AN-0971, Recommendations for Control of Radiated Emissions with isoPower Device. Analog Devices, Inc. 2014. <https://www.analog.com/media/en/technical-documentation/application-notes/AN-0971.pdf>
[25]
Hu T X, Lu Y, Martins R P, et al. An isolated DC-DC converter with full-duplex communication using a single pair of transformers. IEEE J Solid State Circuits, 2025, 60(3), 1070 doi: 10.1109/JSSC.2024.3445316
[26]
Hu T X, Huang M, Martins R P, et al. 31.5 A 750mW, 37% peak efficiency isolated DC-DC converter with 54/18Mb/s full-duplex communication using a single pair of transformers. 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, 504
[27]
Jiang J Q, Zhao L, Tang J Y, et al. A single-link multi-domain-output (SLiMDO) isolated DC-DC converter with passive magnetic flux sharing for local energy distribution and Rx behavior sensing-based global power modulation. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 530
[28]
Pan D F, Xu W W, Wu X F, et al. A 24V-to-20V 6W 73.2%-peak-efficiency isolated DC-DC converter using a transformer-based supply-generating technique. 2024 IEEE Custom Integrated Circuits Conference (CICC), 2024, 1
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    Received: 07 May 2025 Revised: Online: Accepted Manuscript: 20 May 2025

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      Lin Cheng, Dongfang Pan. Trends and emerging techniques in isolated power converters[J]. Journal of Semiconductors, 2025, In Press. doi: 10.1088/1674-4926/25040037 ****L Cheng and D F Pan, Trends and emerging techniques in isolated power converters[J]. J. Semicond., 2025, accepted doi: 10.1088/1674-4926/25040037
      Citation:
      Lin Cheng, Dongfang Pan. Trends and emerging techniques in isolated power converters[J]. Journal of Semiconductors, 2025, In Press. doi: 10.1088/1674-4926/25040037 ****
      L Cheng and D F Pan, Trends and emerging techniques in isolated power converters[J]. J. Semicond., 2025, accepted doi: 10.1088/1674-4926/25040037

      Trends and emerging techniques in isolated power converters

      DOI: 10.1088/1674-4926/25040037
      CSTR: 32376.14.1674-4926.25040037
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      • Lin Cheng received the Ph.D. degree from The Hong Kong University of Science and Technology (HKUST), Kowloon, Hong Kong, in 2016. From 2016 to 2018, he was a Postdoctoral Research Associate with the Department of Electronic and Computer Engineering at HKUST. From 2015 to 2016, he was an Intern Analog Design Engineer with Broadcom Ltd., San Jose, CA. In 2018, he joined the School of Microelectronics, University of Science and Technology of China, Hefei, where he is currently a Professor. His research interests include power management and mixed-signal integrated circuits and systems, wireless power transfer, switched-inductor converters, and automotive ICs. He is a recipient of the IEEE SSCS Pre-doctoral Achievement Award (2014–2015), the Young Scientist Award (Honorable Mention) from the Hong Kong Institution of Science in 2018, and the Best Design Award at the IEEE ASP-DAC University Design Contest in 2020
      • Dongfang Pan received the Ph.D. degree in Electronics Science and Technology from the Department of Electronics Science and Technology, University of Science and Technology of China (USTC) in 2019. From 2018 to 2019, he was a visiting scholar with the Department of Electrical Engineering at Southern Methodist University (SMU), Dallas, TX, USA. From 2019 to 2021, he was a Postdoctoral Fellow with the School of Microelectronics, USTC. From 2022 to 2025, he was an Associate Researcher at the same school. He is currently a Researcher Fellow with the School of Microelectronics, USTC. His research interests include isolated DC-DC converters, high-frequency power ICs, CMOS RF transceivers, and system-level designs involving power amplifiers (PAs), low-noise amplifiers (LNAs), and analog integrated circuits
      • Corresponding author: pdf1992@ustc.edu.cn
      • Received Date: 2025-05-07
        Available Online: 2025-05-20

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