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A transferable route to two-dimensional gate-all-around electronics

Jian Wang§, Ruiqin Wu§ and Jianfeng Jiang

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 Corresponding author: Jianfeng Jiang, jianfengjiang@pku.edu.cn

DOI: 10.1088/1674-4926/26020058CSTR: 32376.14.1674-4926.26020058

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[1]
Frank D J, Dennard R H, Nowak E, et al. Device scaling limits of Si MOSFETs and their application dependencies. Proc IEEE, 2001, 89(3): 259 doi: 10.1109/5.915374
[2]
Kim Y H, Lee D, Huh W, et al. Gate stack engineering of two-dimensional transistors. Nat Electron, 2025, 8(9): 770 doi: 10.1038/s41928-025-01448-5
[3]
Tang J C, Jiang J F, Gao X Y, et al. Low-power 2D gate-all-around logics via epitaxial monolithic 3D integration. Nat Mater, 2025, 24(4): 519 doi: 10.1038/s41563-025-02117-w
[4]
Zhang Q Z, Zhang Y K, Luo Y N, et al. New structure transistors for advanced technology node CMOS ICs. Natl Sci Rev, 2024, 11(3): nwae008 doi: 10.1093/nsr/nwae008
[5]
Zhang S G, Zhang T, Yu H, et al. Wafer-scale high-k HfO2 dielectric films with sub-5-Å equivalent oxide thickness for 2D MoS2 transistors. Nat Commun, 2026, 17: 1888 doi: 10.1038/s41467-026-68584-0
[6]
Guo Y M, Li J X, Zhan X P, et al. Van der Waals polarity-engineered 3D integration of 2D complementary logic. Nature, 2024, 630(8016): 346 doi: 10.1038/s41586-024-07438-5
[7]
Xue C Y, Tan C W, Gao X, et al. Wafer-scale uniform epitaxy of transferable 2D single crystals for gate-all-around nanosheet field effect transistors. Nat Commun, 2025, 16: 10587 doi: 10.1038/s41467-025-65641-y
[8]
Wu Q C, Li Z R, Han B C, et al. Wafer-scale ultrathin and uniform van der Waals ferroelectric oxide. Science, 2026, 391(6784): eadz1655 doi: 10.1126/science.adz1655
[9]
Tan C W, Yu M S, Tang J C, et al. 2D fin field-effect transistors integrated with epitaxial high-k gate oxide. Nature, 2023, 616(7955): 66 doi: 10.1038/s41586-023-05797-z
[10]
Jiang J F, Xu L, Du L J, et al. Yttrium-doping-induced metallization of molybdenum disulfide for ohmic contacts in two-dimensional transistors. Nat Electron, 2024, 7(7): 545 doi: 10.1038/s41928-024-01176-2
[11]
Chen S F, Wang S Y, Liu Z Z, et al. Channel and contact length scaling of two-dimensional transistors using composite metal electrodes. Nat Electron, 2025, 8(5): 394 doi: 10.1038/s41928-025-01382-6
[12]
Wang Y J, Zhang J W, Chen J C, et al. Polarity modulation in compositionally tunable Bi2O2Se thin films. Nat Commun, 2025, 16: 2873 doi: 10.1038/s41467-025-58198-3
Fig. 1.  (Color online) (a) Buffer layer design for mono-oriented nucleation. (b) Cross-sectional scanning transmission electron microscopy (STEM) image of Bi2O2Se/α-Bi2SeO5 heterostructures and α-Bi2SeO5/Bi2O2Se/β-Bi2SeO5 2D GAA heterostructures. (c) Photograph of a batch of 2-inch wafers of 2DGAAheterostructures and 3×3matrix of low-energy electron diffraction images across the 2D GAA wafer. (d) Schematic of transferring 2D GAA film onto flexible and silicon substrates, and STEM image of the fractured interface. (e) Photograph of a wafer-scale field-effect transistor array based on 2D GAA heterostructures, cross-sectional STEM images, and representative transfer characteristics. (f) Schematic diagram and cross-sectional STEM images of an epitaxially integrated 2D GAAFET, alongside a comparison of its transfer curves[7].

[1]
Frank D J, Dennard R H, Nowak E, et al. Device scaling limits of Si MOSFETs and their application dependencies. Proc IEEE, 2001, 89(3): 259 doi: 10.1109/5.915374
[2]
Kim Y H, Lee D, Huh W, et al. Gate stack engineering of two-dimensional transistors. Nat Electron, 2025, 8(9): 770 doi: 10.1038/s41928-025-01448-5
[3]
Tang J C, Jiang J F, Gao X Y, et al. Low-power 2D gate-all-around logics via epitaxial monolithic 3D integration. Nat Mater, 2025, 24(4): 519 doi: 10.1038/s41563-025-02117-w
[4]
Zhang Q Z, Zhang Y K, Luo Y N, et al. New structure transistors for advanced technology node CMOS ICs. Natl Sci Rev, 2024, 11(3): nwae008 doi: 10.1093/nsr/nwae008
[5]
Zhang S G, Zhang T, Yu H, et al. Wafer-scale high-k HfO2 dielectric films with sub-5-Å equivalent oxide thickness for 2D MoS2 transistors. Nat Commun, 2026, 17: 1888 doi: 10.1038/s41467-026-68584-0
[6]
Guo Y M, Li J X, Zhan X P, et al. Van der Waals polarity-engineered 3D integration of 2D complementary logic. Nature, 2024, 630(8016): 346 doi: 10.1038/s41586-024-07438-5
[7]
Xue C Y, Tan C W, Gao X, et al. Wafer-scale uniform epitaxy of transferable 2D single crystals for gate-all-around nanosheet field effect transistors. Nat Commun, 2025, 16: 10587 doi: 10.1038/s41467-025-65641-y
[8]
Wu Q C, Li Z R, Han B C, et al. Wafer-scale ultrathin and uniform van der Waals ferroelectric oxide. Science, 2026, 391(6784): eadz1655 doi: 10.1126/science.adz1655
[9]
Tan C W, Yu M S, Tang J C, et al. 2D fin field-effect transistors integrated with epitaxial high-k gate oxide. Nature, 2023, 616(7955): 66 doi: 10.1038/s41586-023-05797-z
[10]
Jiang J F, Xu L, Du L J, et al. Yttrium-doping-induced metallization of molybdenum disulfide for ohmic contacts in two-dimensional transistors. Nat Electron, 2024, 7(7): 545 doi: 10.1038/s41928-024-01176-2
[11]
Chen S F, Wang S Y, Liu Z Z, et al. Channel and contact length scaling of two-dimensional transistors using composite metal electrodes. Nat Electron, 2025, 8(5): 394 doi: 10.1038/s41928-025-01382-6
[12]
Wang Y J, Zhang J W, Chen J C, et al. Polarity modulation in compositionally tunable Bi2O2Se thin films. Nat Commun, 2025, 16: 2873 doi: 10.1038/s41467-025-58198-3
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    Received: 16 February 2026 Revised: Online: Accepted Manuscript: 05 March 2026

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      Jian Wang, Ruiqin Wu, Jianfeng Jiang. A transferable route to two-dimensional gate-all-around electronics[J]. Journal of Semiconductors, 2026, In Press. doi: 10.1088/1674-4926/26020058 ****J Wang, R Q Wu, and J F Jiang, A transferable route to two-dimensional gate-all-around electronics[J]. J. Semicond., 2026, accepted doi: 10.1088/1674-4926/26020058
      Citation:
      Jian Wang, Ruiqin Wu, Jianfeng Jiang. A transferable route to two-dimensional gate-all-around electronics[J]. Journal of Semiconductors, 2026, In Press. doi: 10.1088/1674-4926/26020058 ****
      J Wang, R Q Wu, and J F Jiang, A transferable route to two-dimensional gate-all-around electronics[J]. J. Semicond., 2026, accepted doi: 10.1088/1674-4926/26020058

      A transferable route to two-dimensional gate-all-around electronics

      DOI: 10.1088/1674-4926/26020058
      CSTR: 32376.14.1674-4926.26020058
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      • Jian Wang is a postdoctoral researcher at the School of Electronics of Peking University. His research interests primarily focus on the fabrication of high-performance two-dimensional transistors and advanced interconnect technology
      • Ruiqin Wu is a PhD candidate at the School of Electronics of Peking University. His research interests primarily focus on the fabrication of high-performance two-dimensional transistors and their three-dimensional integration
      • Jianfeng Jiang is a Principal Investigator at the School of Electronics, Peking University. His research focuses on high-energy-efficiency and novel-architecture electronics based on two-dimensional semiconductors, spanning devices and system integration. He has published as first or corresponding author in Nature (2023, 2025), Science (2025), Nature Electronics (2024), Nature Materials (2025), and Nature Reviews Electrical Engineering (2025) etc
      • Corresponding author: jianfengjiang@pku.edu.cn
      • Received Date: 2026-02-16
        Available Online: 2026-03-05

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