| Citation: |
Xiaofei Xu, Yuhan Bian, Zhiyuan Meng, Yanzhen Jing, Wenqiang Yang, Jing Rao, Mengxiao Chen, CaofengPan. Advances in microneedle electrodes for electromyography acquisition in sports rehabilitation[J]. Journal of Semiconductors, 2026, In Press. doi: 10.1088/1674-4926/26050025
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X F Xu, Y H Bian, Z Y Meng, Y Z Jing, W Q Yang, J Rao, M X Chen, and , Advances in microneedle electrodes for electromyography acquisition in sports rehabilitation[J]. J. Semicond., 2026, accepted doi: 10.1088/1674-4926/26050025
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Advances in microneedle electrodes for electromyography acquisition in sports rehabilitation
DOI: 10.1088/1674-4926/26050025
CSTR: 32376.14.1674-4926.26050025
More Information-
Abstract
Electromyography (EMG) is widely used in sports rehabilitation to evaluate muscle activation, coordination, fatigue, and functional recovery, yet reliable recording remains limited by the electrode−skin interface during repeated motion and prolonged wear. Microneedle electrodes offer a distinct interface strategy by penetrating the stratum corneum and forming lower-impedance, more stable electrical contact than conventional wet or dry electrodes. This review discusses microneedle electrodes for EMG acquisition in sports rehabilitation from a design−to−application perspective. We first clarify the interface requirements of EMG recording in rehabilitation settings and the technical rationale for using microneedle interfaces. We then summarize material and structural design strategies in silicon-, polymer-, and metal-based systems, focusing on how they balance penetration capability, mechanical compliance, stretchability, conductivity, and recording stability. Fabrication routes are further examined in terms of material-structure-process coupling, followed by applications in static assessment, dynamic motion monitoring, and clinical rehabilitation evaluation. This review integrates interface requirements, design, manufacturing, and validation to provide a structured overview of microneedle EMG electrodes' capabilities and limitations for sports rehabilitation. -
References
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Proportional views



Xiaofei Xu received his B.E. degree from Beijing University of Technology in 2025. He is currently pursuing his M.E. degree under the guidance of Prof. Caofeng Pan at Beihang University. His research focuses on wearable electromyography acquisition technology and its application in sports rehabilitation.
Jing Rao is a professor at Beihang University. She received her Ph.D. from Nanyang Technological University and was a Humboldt Research Fellowship holder at the Technical University of Munich in Germany. She was also an assistant professor at the University of New South Wales in Australia. Her main research areas are non-destructive testing, flexible sensors, and structural health monitoring.
Mengxiao Chen is an associate professor at Beihang University. She received her B.S. degree in physics from Northeastern University 2012; and Ph. D. degree in physics from Beijing Institute of Nanoenergy and Nanosystems, CAS, in 2017. Then she joined Nanyang Technological University as a research fellow, and worked at the College of Biomedical Engineering & Instrument Science at Zhejiang University in Hangzhou as a Tenure-track Professor. Her main research interests include soft electronics, bioinspired electronics, and novel functional fiber devices.
Caofeng Pan is a distinguished Professor at Beihang University, and awarded of the National Science Fund for Distinguished Young Scholars. Prof. Pan earned his bachelor's (2005) and doctoral (2010) degrees from the School of Materials Science and Engineering, Tsinghua University. He subsequently conducted postdoctoral research at the Georgia Institute of Technology, USA. From 2013 to 2023, he served as a professor and group leader at the University of Chinese Academy of Sciences and the Beijing Institute of Nanoenergy and Nanosystems, CAS. Since 2023, he has been serving as a distinguished professor and leads a research group at the Institute of Atomic Manufacturing, Beihang University. Prof. Pan’s research focuses on atomic-level manufacturing and low-dimensional semiconductor materials/device for sensing applications.
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