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The outward bridge of implanted medical devices: simultaneous wireless power and data transfer chip solutions

Quanrong Zhuang, Jie Lu, Zixu Wang, Qi’an Zhu, Yi Shi and Hao Qiu

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 Corresponding author: Hao Qiu, haoqiu@nju.edu.cn

DOI: 10.1088/1674-4926/26070025CSTR: 32376.14.1674-4926.26070025

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[1]
Karimi M J, Jin M H, Zhou Y X, et al. Wirelessly powered and bi-directional data communication system with adaptive conversion chain for multisite biomedical implants over single inductive link. IEEE Trans Biomed Circuits Syst, 2024, 18(3): 636. doi: 10.1109/TBCAS.2024.3359772
[2]
Chang M H, Chou L, Liu Y J, et al. A multimodal biosensing system-on-chip with integrated wireless transceiver and power management for stress monitoring. 2026 IEEE International Solid-State Circuits Conference (ISSCC), 2026, 64.
[3]
Tan F, Berner R, Zhao Z Y, et al. A 64-channel, low-power end-to-end transformer-based BCI SoC for efficient motion intention decoding. 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2026, 1.
[4]
Luo Z Y, Liu J, Lee H. A 90%-efficiency 40.68MHz single-stage dual-output regulating rectifier with ZVS and synchronous PFM control for wireless powering. 2023 IEEE International Solid-State Circuits Conference (ISSCC), 2023, 454.
[5]
Lee H S, Eom K, Lee H M. A 90.8%-efficiency SIMO resonant regulating rectifier generating 3 outputs in a half cycle with distributed multi-phase control for wirelessly-powered implantable devices. 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, 448.
[6]
Zhuang Q R, Sun J Y, Li B, et al. A 6.78MHz single-stage regulating rectifier with dual outputs simultaneously charged in a half cycle achieving 92.2% efficiency and 131mW output power. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 188.
[7]
Cui K, Lu Y. A multi-coil scalable energy-shared wireless power receiver network for distributed time-division-multiplexing somatosensory cortex stimulation. 2026 IEEE International Solid-State Circuits Conference (ISSCC), 2026, 164.
[8]
Xiong Y H, Cao W X, Liu X H, et al. A 6.78MHz 94.2% peak efficiency Class-E transmitter with adaptive real-part impedance matching and imaginary-part phase compensation achieving a 33W wireless-power-transfer system. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 190.
[9]
Qiu H, Sakurai T, Takamiya M. A 6.78-MHz multiple-transmitter wireless power transfer system with efficiency maximization by adaptive magnetic field adder IC. IEEE J Solid-State Circuits, 2022, 57(8): 2390. doi: 10.1109/JSSC.2022.3183174
[10]
Chen Y T, Luo Y X, Lin Y F, et al. A high-efficiency wireless power transfer system under wide coupling coefficient range based on phase shift and near-zero-time detection. IEEE J Solid-State Circuits, 2026, 61(1): 353. doi: 10.1109/JSSC.2025.3558520
[11]
Park Y, Hung P D, Youn D, et al. An enhanced-frequency-splitting-based wireless power and data transfer system achieving 60.2% end-to-end efficiency and 1 Mb/s data rate with a sub-cm RX coil for miniaturized implants. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 1.
[12]
Zhuang Q R, Sun J Y, Li B, et al. A 6.78-MHz wireless power and data transfer system achieving simultaneous 48.6% end-to-end efficiency and 4.0 Mb/s forward data delivery with interference-free rectifier. IEEE J Solid-State Circuits, 2025, 60(9): 3283. doi: 10.1109/JSSC.2025.3541290
[13]
Ha S, Kim C, Park J, et al. Energy recycling telemetry IC with simultaneous 11.5 mW power and 6.78 Mb/s backward data delivery over a single 13.56 MHz inductive link. IEEE J Solid-State Circuits, 2016, 51(11): 2664. doi: 10.1109/JSSC.2016.2600864
[14]
Huang Y, Liu B W, Hou Y H, et al. A neuroprosthetic SoC with sensory feedback featuring frequency-splitting-based wireless power transfer with 200Mb/s 0.67pJ/b backscatter data uplink and unsupervised multi-class spike sorting. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 272.
[15]
Lee J, Kim Y, Kim D, et al. A wireless power and synchronized full-duplex data transceiver IC with 400 kbps bidirectional data rate using a single inductive link for low-power systems. 2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2025, 1.
[16]
Lu T Q, Du S J. A simultaneous wireless power and full-duplex data transfer system over a single inductive link achieving 17/3.4Mb/s and 61.1% efficiency for miniature biomedical implants. 2026 IEEE International Solid-State Circuits Conference (ISSCC), 2026, 72.
[17]
Ma L H, Ma Z L, Li Q, et al. A 2.4-GHz reconfigurable digital transmitter with three-vector-synthesized IQ-shared PA and envelope rotation calibration for multi-standard IoT applications. 2026 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2026, 35.
[18]
Lu J, Sun J Y, Li B, et al. A galvanic isolator achieving 117-Mb/s forward data transfer in the presence of 181-kV/μs common-mode transient interference. IEEE J Solid-State Circuits, 2026, 61(7): 3524. doi: 10.1109/JSSC.2025.3635266
[19]
Li W, Duan Y D, Rabaey J M. A 200Mb/s inductively coupled wireless transcranial transceiver achieving 5e-11 BER and 1.5pJ/b transmit energy efficiency. 2018 IEEE International Solid-State Circuits Conference (ISSCC), 2018, 290.
[20]
Ding C, Ding M, Zhao S, et al. A 50-mm2 crystal-free bidirectional WPDT system with carrier-reuse clocking for implantable neural interfaces. 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2026, 1.
Fig. 1.  (Color online) (a) Schematic of the SWPDT system. (b) Link topologies and frequency spectra for the single-link and separate-link SWPDT systems. (c) Typical waveforms of power carrier modulation and data carrier injection.

[1]
Karimi M J, Jin M H, Zhou Y X, et al. Wirelessly powered and bi-directional data communication system with adaptive conversion chain for multisite biomedical implants over single inductive link. IEEE Trans Biomed Circuits Syst, 2024, 18(3): 636. doi: 10.1109/TBCAS.2024.3359772
[2]
Chang M H, Chou L, Liu Y J, et al. A multimodal biosensing system-on-chip with integrated wireless transceiver and power management for stress monitoring. 2026 IEEE International Solid-State Circuits Conference (ISSCC), 2026, 64.
[3]
Tan F, Berner R, Zhao Z Y, et al. A 64-channel, low-power end-to-end transformer-based BCI SoC for efficient motion intention decoding. 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2026, 1.
[4]
Luo Z Y, Liu J, Lee H. A 90%-efficiency 40.68MHz single-stage dual-output regulating rectifier with ZVS and synchronous PFM control for wireless powering. 2023 IEEE International Solid-State Circuits Conference (ISSCC), 2023, 454.
[5]
Lee H S, Eom K, Lee H M. A 90.8%-efficiency SIMO resonant regulating rectifier generating 3 outputs in a half cycle with distributed multi-phase control for wirelessly-powered implantable devices. 2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, 448.
[6]
Zhuang Q R, Sun J Y, Li B, et al. A 6.78MHz single-stage regulating rectifier with dual outputs simultaneously charged in a half cycle achieving 92.2% efficiency and 131mW output power. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 188.
[7]
Cui K, Lu Y. A multi-coil scalable energy-shared wireless power receiver network for distributed time-division-multiplexing somatosensory cortex stimulation. 2026 IEEE International Solid-State Circuits Conference (ISSCC), 2026, 164.
[8]
Xiong Y H, Cao W X, Liu X H, et al. A 6.78MHz 94.2% peak efficiency Class-E transmitter with adaptive real-part impedance matching and imaginary-part phase compensation achieving a 33W wireless-power-transfer system. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 190.
[9]
Qiu H, Sakurai T, Takamiya M. A 6.78-MHz multiple-transmitter wireless power transfer system with efficiency maximization by adaptive magnetic field adder IC. IEEE J Solid-State Circuits, 2022, 57(8): 2390. doi: 10.1109/JSSC.2022.3183174
[10]
Chen Y T, Luo Y X, Lin Y F, et al. A high-efficiency wireless power transfer system under wide coupling coefficient range based on phase shift and near-zero-time detection. IEEE J Solid-State Circuits, 2026, 61(1): 353. doi: 10.1109/JSSC.2025.3558520
[11]
Park Y, Hung P D, Youn D, et al. An enhanced-frequency-splitting-based wireless power and data transfer system achieving 60.2% end-to-end efficiency and 1 Mb/s data rate with a sub-cm RX coil for miniaturized implants. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 1.
[12]
Zhuang Q R, Sun J Y, Li B, et al. A 6.78-MHz wireless power and data transfer system achieving simultaneous 48.6% end-to-end efficiency and 4.0 Mb/s forward data delivery with interference-free rectifier. IEEE J Solid-State Circuits, 2025, 60(9): 3283. doi: 10.1109/JSSC.2025.3541290
[13]
Ha S, Kim C, Park J, et al. Energy recycling telemetry IC with simultaneous 11.5 mW power and 6.78 Mb/s backward data delivery over a single 13.56 MHz inductive link. IEEE J Solid-State Circuits, 2016, 51(11): 2664. doi: 10.1109/JSSC.2016.2600864
[14]
Huang Y, Liu B W, Hou Y H, et al. A neuroprosthetic SoC with sensory feedback featuring frequency-splitting-based wireless power transfer with 200Mb/s 0.67pJ/b backscatter data uplink and unsupervised multi-class spike sorting. 2025 IEEE International Solid-State Circuits Conference (ISSCC), 2025, 272.
[15]
Lee J, Kim Y, Kim D, et al. A wireless power and synchronized full-duplex data transceiver IC with 400 kbps bidirectional data rate using a single inductive link for low-power systems. 2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2025, 1.
[16]
Lu T Q, Du S J. A simultaneous wireless power and full-duplex data transfer system over a single inductive link achieving 17/3.4Mb/s and 61.1% efficiency for miniature biomedical implants. 2026 IEEE International Solid-State Circuits Conference (ISSCC), 2026, 72.
[17]
Ma L H, Ma Z L, Li Q, et al. A 2.4-GHz reconfigurable digital transmitter with three-vector-synthesized IQ-shared PA and envelope rotation calibration for multi-standard IoT applications. 2026 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 2026, 35.
[18]
Lu J, Sun J Y, Li B, et al. A galvanic isolator achieving 117-Mb/s forward data transfer in the presence of 181-kV/μs common-mode transient interference. IEEE J Solid-State Circuits, 2026, 61(7): 3524. doi: 10.1109/JSSC.2025.3635266
[19]
Li W, Duan Y D, Rabaey J M. A 200Mb/s inductively coupled wireless transcranial transceiver achieving 5e-11 BER and 1.5pJ/b transmit energy efficiency. 2018 IEEE International Solid-State Circuits Conference (ISSCC), 2018, 290.
[20]
Ding C, Ding M, Zhao S, et al. A 50-mm2 crystal-free bidirectional WPDT system with carrier-reuse clocking for implantable neural interfaces. 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2026, 1.
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    Received: 14 July 2026 Revised: Online: Accepted Manuscript: 10 September 2026

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      Quanrong Zhuang, Jie Lu, Zixu Wang, Qi’an Zhu, Yi Shi, Hao Qiu. The outward bridge of implanted medical devices: simultaneous wireless power and data transfer chip solutions[J]. Journal of Semiconductors, 2026, In Press. doi: 10.1088/1674-4926/26070025 ****Q R Zhuang, J Lu, Z X Wang, Q Zhu, Y Shi, and H Qiu, The outward bridge of implanted medical devices: simultaneous wireless power and data transfer chip solutions[J]. J. Semicond., 2026, accepted doi: 10.1088/1674-4926/26070025
      Citation:
      Quanrong Zhuang, Jie Lu, Zixu Wang, Qi’an Zhu, Yi Shi, Hao Qiu. The outward bridge of implanted medical devices: simultaneous wireless power and data transfer chip solutions[J]. Journal of Semiconductors, 2026, In Press. doi: 10.1088/1674-4926/26070025 ****
      Q R Zhuang, J Lu, Z X Wang, Q Zhu, Y Shi, and H Qiu, The outward bridge of implanted medical devices: simultaneous wireless power and data transfer chip solutions[J]. J. Semicond., 2026, accepted doi: 10.1088/1674-4926/26070025

      The outward bridge of implanted medical devices: simultaneous wireless power and data transfer chip solutions

      DOI: 10.1088/1674-4926/26070025
      CSTR: 32376.14.1674-4926.26070025
      More Information
      • Quanrong Zhuang received the B.S. degree in Electrical Engineering from the Xi’an Jiaotong University, Xi’an, China, in 2021. He is currently pursuing a Ph.D. degree in Electronic Science and Technology from Nanjing University, Nanjing, China. His research interests include wireless power and data transfer, rectifier, and dc-dc convertor
      • Yi Shi received the B.S. degree in Physics from National University of Defense Technology, China, in 1983, and the MA.Sc. and Ph.D. degrees in Physics from Nanjing University, China, in 1986 and 1989, respectively. He joined Nanjing University as an Assistant Professor in 1989, became an Associate Professor in 1993, and a Professor in 1996. SHI has published extensively on advanced electronic and optoelectronic materials and devices as well as on nanotechnology in professional journals (>700) and conferences (>50). Currently, his research interests is focused on semiconductor materials and devices
      • Hao Qiu received B.S. degree in materials science and M.Eng. degree in electrical engineering from Nanjing University, China, in 2010 and 2013, respectively, and Ph.D. degree in electrical engineering from The University of Tokyo, Japan, in 2016. He joined School of Electronic Science and Engineering, Nanjing University, China, in 2021, where he is currently an associate professor. He was a researcher with The University of Tokyo from 2017 to 2020. His research interests include isolated and wireless power converters, gate drivers for wide bandgap power devices, switched-mode power converters, and low-dimensional semiconductor nano-systems.Dr. Qiu (IEEE Senior Member) received the International Solid-State Circuits Conference (ISSCC) Silkroad Award in 2025, the National Natural Science Fund for Excellent Young Scholars in 2021, the First Prize of Science and Technology Award of Jiangsu Province in 2016, and the IEEE Electron Devices Society (EDS) Japan Chapter Student Award in 2016. He was selected as one of Highly Cited Chinese Researchers by Elsevier in 2021. He is serving as a TPC member of the International Conference on Solid State Devices and Materials (SSDM) since 2025. He served as a Research Fellow with the Japan Society for the Promotion of Science (JSPS) from 2015 to 2017 and a Representative with the Japan Society of Applied Physics (JSAP) from 2016 and 2018
      • Corresponding author: haoqiu@nju.edu.cn
      • Received Date: 2026-07-14
        Available Online: 2026-09-10

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