J. Semicond. > 2011, Volume 32 > Issue 2 > 024011

SEMICONDUCTOR DEVICES

Comparison of the copper and gold wire bonding processes for LED packaging

Chen Zhaohui, Liu Yong and Liu Sheng

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DOI: 10.1088/1674-4926/32/2/024011

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Abstract: Wire bonding is one of the main processes of the LED packaging which provides electrical interconnection between the LED chip and lead frame. The gold wire bonding process has been widely used in LED packaging industry currently. However, due to the high cost of gold wire, copper wire bonding is a good substitute for the gold wire bonding which can lead to significant cost saving. In this paper, the copper and gold wire bonding processes on the high power LED chip are compared and analyzed with finite element simulation. This modeling work may provide guidelines for the parameter optimization of copper wire bonding process on the high power LED packaging.

Key words: LED packagingwire bondingcopper wireFEM

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    Received: 18 August 2015 Revised: Online: Published: 01 February 2011

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      Chen Zhaohui, Liu Yong, Liu Sheng. Comparison of the copper and gold wire bonding processes for LED packaging[J]. Journal of Semiconductors, 2011, 32(2): 024011. doi: 10.1088/1674-4926/32/2/024011 ****Chen Z H, Liu Y, Liu S. Comparison of the copper and gold wire bonding processes for LED packaging[J]. J. Semicond., 2011, 32(2): 024011. doi: 10.1088/1674-4926/32/2/024011.
      Citation:
      Chen Zhaohui, Liu Yong, Liu Sheng. Comparison of the copper and gold wire bonding processes for LED packaging[J]. Journal of Semiconductors, 2011, 32(2): 024011. doi: 10.1088/1674-4926/32/2/024011 ****
      Chen Z H, Liu Y, Liu S. Comparison of the copper and gold wire bonding processes for LED packaging[J]. J. Semicond., 2011, 32(2): 024011. doi: 10.1088/1674-4926/32/2/024011.

      Comparison of the copper and gold wire bonding processes for LED packaging

      DOI: 10.1088/1674-4926/32/2/024011
      • Received Date: 2015-08-18

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