J. Semicond. > 2011, Volume 32 > Issue 2 > 026001

SEMICONDUCTOR TECHNOLOGY

Novel photoresist stripping technology using steam-water mixture

Wang Lei, Hui Yu, Gao Chaoqun and Jing Yupeng

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DOI: 10.1088/1674-4926/32/2/026001

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Abstract: A novel wet vapor photoresist stripping technology is developed as an alternative to dry plasma ashing and wet stripping. Experiments using this technology to strip hard baked SU-8 photoresist, aurum and chromium film are carried out. Then the images of stripping results are shown and the mechanism is analyzed and discussed. The most striking result of this experiment is that the spraying mixture of steam and water droplets can strip photoresist and even metal film with ease.

Key words: photoresist stripping

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    Received: 18 August 2015 Revised: 27 September 2010 Online: Published: 01 February 2011

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      Article Navigation >  Journal of Semiconductors  > 2011  >  32(2): 026001
      Wang Lei, Hui Yu, Gao Chaoqun, Jing Yupeng. Novel photoresist stripping technology using steam-water mixture[J]. Journal of Semiconductors, 2011, 32(2): 026001. doi: 10.1088/1674-4926/32/2/026001 ****Wang L, Hui Y, Gao C Q, Jing Y P. Novel photoresist stripping technology using steam-water mixture[J]. J. Semicond., 2011, 32(2): 026001. doi: 10.1088/1674-4926/32/2/026001.
      Citation:
      Wang Lei, Hui Yu, Gao Chaoqun, Jing Yupeng. Novel photoresist stripping technology using steam-water mixture[J]. Journal of Semiconductors, 2011, 32(2): 026001. doi: 10.1088/1674-4926/32/2/026001 ****
      Wang L, Hui Y, Gao C Q, Jing Y P. Novel photoresist stripping technology using steam-water mixture[J]. J. Semicond., 2011, 32(2): 026001. doi: 10.1088/1674-4926/32/2/026001.
      shu

      Novel photoresist stripping technology using steam-water mixture

      DOI: 10.1088/1674-4926/32/2/026001

      • Microelectronic Equipment Technology Department, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

      • Received Date: 2015-08-18
      • Accepted Date: 2010-06-29
      • Revised Date: 2010-09-27
      • Published Date: 2011-01-10

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