| Citation: |
Guo Dongming, Xu Chi, Kang Renke, Jin Zhuji. Model analysis and experimental investigation of the friction torque during the CMP process[J]. Journal of Semiconductors, 2011, 32(3): 036002. doi: 10.1088/1674-4926/32/3/036002
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Guo D M, Xu C, Kang R K, Jin Z J. Model analysis and experimental investigation of the friction torque during the CMP process[J]. J. Semicond., 2011, 32(3): 036002. doi: 10.1088/1674-4926/32/3/036002.
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Model analysis and experimental investigation of the friction torque during the CMP process
DOI: 10.1088/1674-4926/32/3/036002
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Abstract
A model for calculating friction torque during the chemical mechanical polishing (CMP) process is presented, and the friction force and torque detection experiments during the CMP process are carried out to verify the model. The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.-
Keywords:
- CMP,
- friction torque,
- endpoint detection
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References
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Proportional views
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