Chin. J. Semicond. > 1999, Volume 20 > Issue 10 > 906-910
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倒装芯片中铝腐蚀的红外显微镜观测研究

卢基存 , 宗祥福 , 吴建华 and 林添明

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    Received: 19 August 2015 Revised: Online: Published: 01 October 1999

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      Article Navigation >  Journal of Semiconductors  > 1999  >  20(10): 906-910
      卢基存, 宗祥福, 吴建华, 林添明. 倒装芯片中铝腐蚀的红外显微镜观测研究[J]. 半导体学报(英文版), 1999, 20(10): 906-910.
      Citation:
      卢基存, 宗祥福, 吴建华, 林添明. 倒装芯片中铝腐蚀的红外显微镜观测研究[J]. 半导体学报(英文版), 1999, 20(10): 906-910.
      shu

      • Received Date: 2015-08-19

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