Chin. J. Semicond. > 2000, Volume 21 > Issue 9 > 927-933
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电迁移与工艺相关的关系

焦慧芳 , 孔学东 , 贾新章 , 孙青 , 扬文 and 徐征

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Key words: 电迁移, 金属化, 可靠性, 数学分析

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    Received: 20 August 2015 Revised: Online: Published: 01 September 2000

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      Article Navigation >  Journal of Semiconductors  > 2000  >  21(9): 927-933
      焦慧芳, 孔学东, 贾新章, 孙青, 扬文, 徐征. 电迁移与工艺相关的关系[J]. 半导体学报(英文版), 2000, 21(9): 927-933.
      Citation:
      焦慧芳, 孔学东, 贾新章, 孙青, 扬文, 徐征. 电迁移与工艺相关的关系[J]. 半导体学报(英文版), 2000, 21(9): 927-933.
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      • Received Date: 2015-08-20

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