Chin. J. Semicond. > 1998, Volume 19 > Issue 8 > 609-614
|

CONTENTS

功率循环中表面安装器件(SMD)热变形的实时全息干涉测量研究

王卫宁 and 梁镜明

+ Author Affiliations

PDF

    • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 2624 Times PDF downloads: 1645 Times Cited by: 0 Times

    History

    Received: 18 August 2015 Revised: Online: Published: 01 August 1998

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 1998  >  19(8): 609-614
      王卫宁, 梁镜明. 功率循环中表面安装器件(SMD)热变形的实时全息干涉测量研究[J]. 半导体学报(英文版), 1998, 19(8): 609-614.
      Citation:
      王卫宁, 梁镜明. 功率循环中表面安装器件(SMD)热变形的实时全息干涉测量研究[J]. 半导体学报(英文版), 1998, 19(8): 609-614.
      shu

      • Received Date: 2015-08-18

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return