Chin. J. Semicond. > 2005, Volume 26 > Issue 8 > 1653-1655
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多晶硅加热法评价金属互连线电迁移寿命

赵毅 , 曹刚 and 徐向明

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Key words: 金属互连线, 电迁移, 多晶硅

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    Received: 18 August 2015 Revised: Online: Published: 01 August 2005

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      Article Navigation >  Journal of Semiconductors  > 2005  >  26(8): 1653-1655
      赵毅, 曹刚, 徐向明. 多晶硅加热法评价金属互连线电迁移寿命[J]. 半导体学报(英文版), 2005, 26(8): 1653-1655.
      Citation:
      赵毅, 曹刚, 徐向明. 多晶硅加热法评价金属互连线电迁移寿命[J]. 半导体学报(英文版), 2005, 26(8): 1653-1655.
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      • Received Date: 2015-08-18

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