Chin. J. Semicond. > 2005, Volume 26 > Issue 8 > 1595-1598
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基于SIMOX的耐高温压力传感器芯片制作

王权 , 丁建宁 , 王文襄 and 熊斌

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Key words: 高温压力传感器, SIMOX, 低压化学气相淀积, 电感耦合等离子体深刻蚀

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    Received: 18 August 2015 Revised: Online: Published: 01 August 2005

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      Article Navigation >  Journal of Semiconductors  > 2005  >  26(8): 1595-1598
      王权, 丁建宁, 王文襄, 熊斌. 基于SIMOX的耐高温压力传感器芯片制作[J]. 半导体学报(英文版), 2005, 26(8): 1595-1598.
      Citation:
      王权, 丁建宁, 王文襄, 熊斌. 基于SIMOX的耐高温压力传感器芯片制作[J]. 半导体学报(英文版), 2005, 26(8): 1595-1598.
      shu

      • Received Date: 2015-08-18

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