Chin. J. Semicond. > 2004, Volume 25 > Issue 11 > 1510-1514
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一种新型的集成电路金属连线温度分析解析模型

王乃龙 and 周润德

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Key words: 焦耳热, 通孔效应, 边缘传热效应, 热传导

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    Received: 19 August 2015 Revised: Online: Published: 01 November 2004

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      Article Navigation >  Journal of Semiconductors  > 2004  >  25(11): 1510-1514
      王乃龙, 周润德. 一种新型的集成电路金属连线温度分析解析模型[J]. 半导体学报(英文版), 2004, 25(11): 1510-1514.
      Citation:
      王乃龙, 周润德. 一种新型的集成电路金属连线温度分析解析模型[J]. 半导体学报(英文版), 2004, 25(11): 1510-1514.
      shu

      • Received Date: 2015-08-19

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