Chin. J. Semicond. > 2002, Volume 23 > Issue 6 > 655-659
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球栅阵列倒装焊封装中的热应变值的测试

李禾 , 傅艳军 , 李仁增 and 严超华

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Key words: 高温云纹, 光栅, 倒装焊, 热疲劳

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    Received: 19 August 2015 Revised: Online: Published: 01 June 2002

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      Article Navigation >  Journal of Semiconductors  > 2002  >  23(6): 655-659
      李禾, 傅艳军, 李仁增, 严超华. 球栅阵列倒装焊封装中的热应变值的测试[J]. 半导体学报(英文版), 2002, 23(6): 655-659.
      Citation:
      李禾, 傅艳军, 李仁增, 严超华. 球栅阵列倒装焊封装中的热应变值的测试[J]. 半导体学报(英文版), 2002, 23(6): 655-659.
      shu

      • Received Date: 2015-08-19

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