| Citation: |
Ma Ziwen, Tang Zirong, Liao Guanglan, Shi Tielin, Nie Lei, Zhou Ping. Finite Element Simulation and Process Optimization of Localized Laser Bonding[J]. Journal of Semiconductors, 2007, 28(6): 995-1000.
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Ma Z W, Tang Z R, Liao G L, Shi T L, Nie L, Zhou P. Finite Element Simulation and Process Optimization of Localized Laser Bonding[J]. Chin. J. Semicond., 2007, 28(6): 995.
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Finite Element Simulation and Process Optimization of Localized Laser Bonding
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Abstract
The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method.In the model,the temperature distribution with different process parameters is simulated and the bondline width is obtained.Then the key process parameters of laser bonding,including laser power,scanning velocity,and initial temperature,are obtained with the help of scanning experiments.Finally,with regression analysis on the simulation results,a regression model is made and the optimal process parameters of laser bonding are found.This can provide a theoretical basis for further study on laser bonding. -
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