Chin. J. Semicond. > 1998, Volume 19 > Issue 9 > 702-706
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用TOF-SIMS研究半导体芯片铝键合点上的有机沾污

郑国祥 , 李越生 , 宗祥福 , 任翀 , 罗俊一 and 史刚

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    Received: 18 August 2015 Revised: Online: Published: 01 September 1998

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      Article Navigation >  Journal of Semiconductors  > 1998  >  19(9): 702-706
      郑国祥, 李越生, 宗祥福, 任翀, 罗俊一, 史刚. 用TOF-SIMS研究半导体芯片铝键合点上的有机沾污[J]. 半导体学报(英文版), 1998, 19(9): 702-706.
      Citation:
      郑国祥, 李越生, 宗祥福, 任翀, 罗俊一, 史刚. 用TOF-SIMS研究半导体芯片铝键合点上的有机沾污[J]. 半导体学报(英文版), 1998, 19(9): 702-706.
      shu

      • Received Date: 2015-08-18

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