Chin. J. Semicond. > 2002, Volume 23 > Issue 6 > 660-667
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倒扣芯片连接焊点的热疲劳失效

彩霞 , 陈柳 , 张群 , 徐步陆 , 黄卫东 , 谢晓明 and 程兆年

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Key words: 倒扣芯片连接, 芯下填料, 温度循环, 三维有限元模拟

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    Received: 19 August 2015 Revised: Online: Published: 01 June 2002

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      Article Navigation >  Journal of Semiconductors  > 2002  >  23(6): 660-667
      彩霞, 陈柳, 张群, 徐步陆, 黄卫东, 谢晓明, 程兆年. 倒扣芯片连接焊点的热疲劳失效[J]. 半导体学报(英文版), 2002, 23(6): 660-667.
      Citation:
      彩霞, 陈柳, 张群, 徐步陆, 黄卫东, 谢晓明, 程兆年. 倒扣芯片连接焊点的热疲劳失效[J]. 半导体学报(英文版), 2002, 23(6): 660-667.
      shu

      • Received Date: 2015-08-19

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