Chin. J. Semicond. > 2002, Volume 23 > Issue 6 > 651-654
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开路缺陷的软故障关键面积研究

陈太峰 , 郝跃 , 马佩军 , 张进城 , 赵天绪 and 刘宁

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Key words: 软故障, 硬故障, 互连线, 关键面积

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    Received: 19 August 2015 Revised: Online: Published: 01 June 2002

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      Article Navigation >  Journal of Semiconductors  > 2002  >  23(6): 651-654
      陈太峰, 郝跃, 马佩军, 张进城, 赵天绪, 刘宁. 开路缺陷的软故障关键面积研究[J]. 半导体学报(英文版), 2002, 23(6): 651-654.
      Citation:
      陈太峰, 郝跃, 马佩军, 张进城, 赵天绪, 刘宁. 开路缺陷的软故障关键面积研究[J]. 半导体学报(英文版), 2002, 23(6): 651-654.
      shu

      • Received Date: 2015-08-19

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