Chin. J. Semicond. > 2005, Volume 26 > Issue 2 > 410-413

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Abstract: 用基于改进的RCA清洗液结合兆声清洗法和离心喷射法清洗抛光的硅片,干燥后用激光扫描法测试抛光硅片表面颗粒.结果表明,改进的RCA清洗液结合兆声的清洗方法对于去除硅片表面的微小颗粒具有更高的效率.

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    Received: 19 August 2015 Revised: Online: Published: 01 February 2005

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      凤坤, 史迅达, 李刚, 许峰, 刘培东. 兆声清洗法和离心喷射清洗法的比较[J]. Journal of Semiconductors, 2005, 26(2): 410-413. ****兆声清洗法和离心喷射清洗法的比较[J]. Chin. J. Semicond., 2005, 26(2): 410.
      Citation:
      凤坤, 史迅达, 李刚, 许峰, 刘培东. 兆声清洗法和离心喷射清洗法的比较[J]. Journal of Semiconductors, 2005, 26(2): 410-413. ****
      兆声清洗法和离心喷射清洗法的比较[J]. Chin. J. Semicond., 2005, 26(2): 410.

      兆声清洗法和离心喷射清洗法的比较

      • Received Date: 2015-08-19

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