J. Semicond. > 2008, Volume 29 > Issue 9 > 1770-1774

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Through High Temperature Annealing

Zhan Rong, Zhao Youwen, Yu Huiyong, Gao Yongliang and Hui Feng

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Abstract: Semi-insulating (SI) GaAs single crystals with low dislocation density are grown by the vertical gradient freezing (VGF) method.The as-grown VGF-SI-GaAs exhibits low resistivity,low mobility,weak electrical compensation,and poor uniformity.SI-GaAs wafers sliced from the single crystal ingots are annealed at three different temperatures in a sealed quartz tube with controlled arsenic pressure.The results indicate that resistivity and carrier mobility of the VGF-SI-GaAs are enhanced significantly after annealing at 1160℃ for 12h.Using the Hall effect,thermally stimulated current spectroscopy (TSC),and infrared absorption spectroscopy,the electrical property,deep level defects,and concentration of EL2 and C in the as-grown and the annealed VGF-SI-GaAs samples are analyzed,respectively.A conventional LEC SI-GaAs sample is also measured for comparison.The as-grown VGF-SI-GaAs has lower EL2 content than LEC-SI-GaAs.However,the EL2 content in VGF-SI-GaAs increases after the thermal annealing,while defects with shallower levels are suppressed effectively,resulting in better electrical compensation and improved properties.

Key words: VGFSI-GaAselectrical compensationdefect

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    Received: 18 August 2015 Revised: 13 May 2008 Online: Published: 01 September 2008

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      Zhan Rong, Zhao Youwen, Yu Huiyong, Gao Yongliang, Hui Feng. Through High Temperature Annealing[J]. Journal of Semiconductors, 2008, 29(9): 1770-1774. ****Zhan R, Zhao Y W, Yu H Y, Gao Y L, Hui F. Through High Temperature Annealing[J]. J. Semicond., 2008, 29(9): 1770.
      Citation:
      Zhan Rong, Zhao Youwen, Yu Huiyong, Gao Yongliang, Hui Feng. Through High Temperature Annealing[J]. Journal of Semiconductors, 2008, 29(9): 1770-1774. ****
      Zhan R, Zhao Y W, Yu H Y, Gao Y L, Hui F. Through High Temperature Annealing[J]. J. Semicond., 2008, 29(9): 1770.

      Through High Temperature Annealing

      • Received Date: 2015-08-18
      • Accepted Date: 2008-02-29
      • Revised Date: 2008-05-13
      • Published Date: 2008-09-03

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