Chin. J. Semicond. > 2001, Volume 22 > Issue 12 > 1516-1518
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硅片发生室温键合所需的平整度条件

韩伟华 and 余金中

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Key words: 室温键合界面缝隙, 粗糙度, 薄板弹性形变

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    Received: 20 August 2015 Revised: Online: Published: 01 December 2001

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      Article Navigation >  Journal of Semiconductors  > 2001  >  22(12): 1516-1518
      韩伟华, 余金中. 硅片发生室温键合所需的平整度条件[J]. 半导体学报(英文版), 2001, 22(12): 1516-1518.
      Citation:
      韩伟华, 余金中. 硅片发生室温键合所需的平整度条件[J]. 半导体学报(英文版), 2001, 22(12): 1516-1518.
      shu

      • Received Date: 2015-08-20

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