Chin. J. Semicond. > 2003, Volume 24 > Issue 6 > 663-667
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多孔硅的干燥方法

虞献文 , 朱荣锦 , 朱自强 , 应桃开 and 李爱珍

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Key words: 多孔硅, 阴极还原, 表面处理技术

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    Received: 20 August 2015 Revised: Online: Published: 01 June 2003

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      Article Navigation >  Journal of Semiconductors  > 2003  >  24(6): 663-667
      虞献文, 朱荣锦, 朱自强, 应桃开, 李爱珍. 多孔硅的干燥方法[J]. 半导体学报(英文版), 2003, 24(6): 663-667.
      Citation:
      虞献文, 朱荣锦, 朱自强, 应桃开, 李爱珍. 多孔硅的干燥方法[J]. 半导体学报(英文版), 2003, 24(6): 663-667.
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      • Received Date: 2015-08-20

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