Chin. J. Semicond. > 2001, Volume 22 > Issue 8 > 1081-1086
|

CONTENTS

ULSI互连系统热特性的模拟

阮刚 and 肖夏

+ Author Affiliations

PDF

Key words: ULSI互连, xerogel, 热特性模拟

    • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 2019 Times PDF downloads: 1156 Times Cited by: 0 Times

    History

    Received: 20 August 2015 Revised: Online: Published: 01 August 2001

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 2001  >  22(8): 1081-1086
      阮刚, 肖夏. ULSI互连系统热特性的模拟[J]. 半导体学报(英文版), 2001, 22(8): 1081-1086.
      Citation:
      阮刚, 肖夏. ULSI互连系统热特性的模拟[J]. 半导体学报(英文版), 2001, 22(8): 1081-1086.
      shu

      • Received Date: 2015-08-20

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return