Chin. J. Semicond. > 2002, Volume 23 > Issue 8 > 874-880
|

CONTENTS

板上芯片固化及热处理过程中表面残余应力的演变

孙志国 , 张群 , 黄卫东 , 蒋玉齐 , 程兆年 and 罗乐

+ Author Affiliations

PDF

Key words: 硅压阻应力传感器, 固化, 热处理, 残余应力

    • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 2533 Times PDF downloads: 842 Times Cited by: 0 Times

    History

    Received: 19 August 2015 Revised: Online: Published: 01 August 2002

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 2002  >  23(8): 874-880
      孙志国, 张群, 黄卫东, 蒋玉齐, 程兆年, 罗乐. 板上芯片固化及热处理过程中表面残余应力的演变[J]. 半导体学报(英文版), 2002, 23(8): 874-880.
      Citation:
      孙志国, 张群, 黄卫东, 蒋玉齐, 程兆年, 罗乐. 板上芯片固化及热处理过程中表面残余应力的演变[J]. 半导体学报(英文版), 2002, 23(8): 874-880.
      shu

      • Received Date: 2015-08-19

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return