Chin. J. Semicond. > 2000, Volume 21 > Issue 6 > 614-619
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亚微米IC器件中接触孔的填充和铝金属化工艺的技术

梁京 , 黄榕旭 , 郑国祥 , 林健 , 庞海舟 and 宗祥福

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Key words: 阶梯覆盖, 平坦化, 阻挡层, 浸润层, 平行化器, 扫描电镜

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    Received: 20 August 2015 Revised: Online: Published: 01 June 2000

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      Article Navigation >  Journal of Semiconductors  > 2000  >  21(6): 614-619
      梁京, 黄榕旭, 郑国祥, 林健, 庞海舟, 宗祥福. 亚微米IC器件中接触孔的填充和铝金属化工艺的技术[J]. 半导体学报(英文版), 2000, 21(6): 614-619.
      Citation:
      梁京, 黄榕旭, 郑国祥, 林健, 庞海舟, 宗祥福. 亚微米IC器件中接触孔的填充和铝金属化工艺的技术[J]. 半导体学报(英文版), 2000, 21(6): 614-619.
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      • Received Date: 2015-08-20

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