CALL FOR PAPERS

Thanks to the mature semiconductor technologies, well-developed methods have been applied to generate scalable quantum light sources from different semiconductor materials. Great achievements have been obtained in improving their emission and collection efficiencies. The indistinguishability between different light sources has also been critically improved. These solid-state single photon and entangled photon sources have shown important applications in quantum simulation, quantum communication and quantum metrology. Their interactions with remoted quantum systems show the potentiality to construct a quantum network. More and more flexible semiconductor quantum emitters are generated and integrated, which would simulate novel applications and develop new quantum devices.

This special issue will contain articles on quantum light sources from semiconductors. Topics include but not limited to:

l　Generation and fabrication of light emitters in semiconductors;
l　Methods to enhance emission and collection efficiencies;
l　Integrated photonic and electrical devices based on semiconductor quantum light;
l　Property and application of quantum light sources from semiconductors;
l　Theory and modeling of novel quantum light emitters.

The issue attempts to provide a latest overview of the rapid developing research area of quantum light sources from semiconductors. We hope that this issue can benefit researches on related topics.

GUEST EDITORS:

Prof. Xiulai Xu, Institute of Physics, Chinese Academy of Sciences, Beijing, China  
Prof. Jin-Shi Xu, University of Science and Technology of China, Hefei, China

Manuscript Submission:

Manuscripts much be prepared according to Journal’s guidelines, available at http://iopscience.iop.org/journal/1674-4926 .

Submit your manuscripts via the online submission address at https://mc03.manuscriptcentral.com/jos-iop 

Please notify well in advance for your intension to submit a research paper.

Key timetable dates:

Manuscript due: April 30, 2019  
Authors’ notification: May 31, 2019   
Publication date: July 10, 2019