J. Semicond. > Volume 36 > Issue 10 > Article Number: 102006

Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

Hongqi Jing , Li Zhong , , Yuxi Ni , Junjie Zhang , Suping Liu and Xiaoyu Ma

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Abstract: A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks.Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software.Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced.Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime.This heat-sink is an ideal choice for the package of high power density laser diode array stacks.

Key words: heat-sinkthermal simulationflow velocitytemperature

Abstract: A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks.Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software.Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced.Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime.This heat-sink is an ideal choice for the package of high power density laser diode array stacks.

Key words: heat-sinkthermal simulationflow velocitytemperature



References:

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Yan L Z, Wang Y C, Chen G F. Experimental research of a multipulse Yb-doped fiber mode-lock laser[J]. J Optoelectron Laser, 2007, 18(5): 533.

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Niu Gang, Fan Zhongwei, Wang Peifeng. A single fiber coupling module with the output power of 50 W[J]. J Optoelectron Laser, 2008, 19(4): 427.

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[7]

Zhang Hongrui, Gao Mingyi, Zheng Yi. High power diodeend-pumped Nd:YVO4 laser[J]. Chinese J Lasers, 2004, 31(1): 19.

[8]

Ma Jiehui, Fang Gaohui, Lan Yongsheng. AIN monolithic microchannel cooled heatsink for high power laser diode array[J]. Chinese Journal of Semiconductors, 2005, 26(3): 476.

[9]

Yu Jinzhong. Advance in optoelectronics showcased at CLEO'97[J]. Semicond Optoelectron, 1998, 19(3): 1.

[10]

Tian Z H, Sun C L, Cao J S. Junction temperature measurement of high power diode lasers[J]. Opt Precision Eng, 2011, 19(6): 1244.

[11]

Lu Gui, Duan Yuanyuan, Wang Xiaodong. Effects of manifold designs on flow and thermal performances of microchannel heat sink[J]. Journal of Basic Science and Engineering, 2013, 21(2): 345.

[12]

Tao W Q. Numerical heat transfer[J]. Xi'an:Xi'an Jiaotong University Press, 2001: 1.

[13]

Li Jiang, Li Chao, Xu Hao. Thermal analysis of high power semiconductor laser bar[J]. Chinese Journal of Luminescence, 2014, 35(12): 1474.

[14]

Vafai K, Zhu L. Analysis of two-layered micro-channel heat sink concept in electronic cooling[J]. International Journal of Heat and Mass Transfer, 1999, 42: 2287.

[15]

Qu W, Mudawar I. Analysis of three-dimensional heat transfer in micro-channel heat sinks[J]. International Journal of Heat and Mass Transfer, 2002, 45: 3973.

[16]

Liu Guang, Tang Xiaojun, Wang Chao. Design of microchannel heat sink for high power laser diode[J]. Journal of High Power Laser and Particle Beams, 2011, 23(8): 2057.

[1]

Samsce E, Andersen P E. Improvement of spatial and temporal coherence of a broad area laser diode using an external-cavity design with double grating feedback[J]. Opt Express, 2004, 12(4): 609.

[2]

Talbot C L, Frese M E J, Eang D. Linewidth reduction in a large-smile laser diode array[J]. Appl Opt, 2005, 44(29): 6264.

[3]

Yan L Z, Wang Y C, Chen G F. Experimental research of a multipulse Yb-doped fiber mode-lock laser[J]. J Optoelectron Laser, 2007, 18(5): 533.

[4]

Niu Gang, Fan Zhongwei, Wang Peifeng. A single fiber coupling module with the output power of 50 W[J]. J Optoelectron Laser, 2008, 19(4): 427.

[5]

Fan T Y, Byer R L. Diode laser-pumped solid state lasers[J]. IEEE J Quantum Electron, 1988, 24(6): 895.

[6]

Hutchison S B, Berezinskaya A M, Petersen A B. High energy, high peak power diode pumped solid state lasers for materials processing[J]. SPIE, 1996, 2888: 121.

[7]

Zhang Hongrui, Gao Mingyi, Zheng Yi. High power diodeend-pumped Nd:YVO4 laser[J]. Chinese J Lasers, 2004, 31(1): 19.

[8]

Ma Jiehui, Fang Gaohui, Lan Yongsheng. AIN monolithic microchannel cooled heatsink for high power laser diode array[J]. Chinese Journal of Semiconductors, 2005, 26(3): 476.

[9]

Yu Jinzhong. Advance in optoelectronics showcased at CLEO'97[J]. Semicond Optoelectron, 1998, 19(3): 1.

[10]

Tian Z H, Sun C L, Cao J S. Junction temperature measurement of high power diode lasers[J]. Opt Precision Eng, 2011, 19(6): 1244.

[11]

Lu Gui, Duan Yuanyuan, Wang Xiaodong. Effects of manifold designs on flow and thermal performances of microchannel heat sink[J]. Journal of Basic Science and Engineering, 2013, 21(2): 345.

[12]

Tao W Q. Numerical heat transfer[J]. Xi'an:Xi'an Jiaotong University Press, 2001: 1.

[13]

Li Jiang, Li Chao, Xu Hao. Thermal analysis of high power semiconductor laser bar[J]. Chinese Journal of Luminescence, 2014, 35(12): 1474.

[14]

Vafai K, Zhu L. Analysis of two-layered micro-channel heat sink concept in electronic cooling[J]. International Journal of Heat and Mass Transfer, 1999, 42: 2287.

[15]

Qu W, Mudawar I. Analysis of three-dimensional heat transfer in micro-channel heat sinks[J]. International Journal of Heat and Mass Transfer, 2002, 45: 3973.

[16]

Liu Guang, Tang Xiaojun, Wang Chao. Design of microchannel heat sink for high power laser diode[J]. Journal of High Power Laser and Particle Beams, 2011, 23(8): 2057.

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H Q Jing, L Zhong, Y X Ni, J J Zhang, S P Liu, X Y Ma. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. J. Semicond., 2015, 36(10): 102006. doi: 10.1088/1674-4926/36/10/102006.

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Manuscript received: 07 January 2015 Manuscript revised: Online: Published: 01 October 2015

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