Fig. 1.
(Color online) (a) Frequency count of wavelength residual (871 lasers) and (b) measured lasing spectra of one 60-channel array.
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| Citation: |
Xiangfei Chen. Precision photonic integration for future large-scale photonic integrated circuits[J]. Journal of Semiconductors, 2019, 40(5): 050301. doi: 10.1088/1674-4926/40/5/050301
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X F Chen, Precision photonic integration for future large-scale photonic integrated circuits[J]. J. Semicond., 2019, 40(5): 050301. doi: 10.1088/1674-4926/40/5/050301.
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Precision photonic integration for future large-scale photonic integrated circuits
DOI: 10.1088/1674-4926/40/5/050301
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Abstract
Since the proposal of the concept of photonic integrated circuits (PICs), tremendous progress has been made. In 2005, Infinera Corp. rolled out the first commercial PICs, in which hundreds of optical functions were integrated onto a small form factor chip for wavelength division multiplexing (WDM) systems[1 ], then a monolithically integrated 10 × 10 Gb/s WDM chip has been demonstrated, the channel number is ten[2 ]. Like ICs, large-scale PICs (LS-PICs) will be sure to be pursued. However, there are still some general challenges associated with LS-PICs. The challenges for III–V (mainly InP) PICs is the semiconductor process, which is not mature for LS-PICs. Up to now, the channel number in commercial III–V WDM PICs by Infinera is still about ten or less. For silicon photonics, the challenge is the silicon based light source. The low cost and mature solution for silicon lasers is still unavailable and only 4 × 25 Gb/s PICs are deployed by Intel Corp. after 18-year R&D investment. Thus it is still unavailable for practical LS-PICs in the present times. -
References
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